industry news
Subscribe Now

Highly Integrated Quad Low-Side Switch from STMicroelectronics Presents Rich Diagnostics for Smart Automation

Geneva, May 23, 2018 — The STMicroelectronics IPS4260L quad low-side intelligent power switch boosts efficiency and reliability in industrial automation, with four 260mΩTYP RDS(ON) power switches and protection features in a space-efficient, thermally enhanced package. The IC can manage up to 2.4A@TAMB=85°C (0.6A per channel or 2.4A on single channel) with the possibility to set current limitation threshold by external resistor and to parallelize the channel. 
 

The very low rise and fall time (tr, tf < 1μs) allows high switching frequency (up to 250kHz) and makes it ideal for servo drives, motor controls, industrial-PC peripherals, programmable logic controllers (PLCs), and general low-side switching of loads connected to the positive supply, the IPS4260L provides rich diagnostics for Smart Industry / Industry 4.0 smart-manufacturing applications.

The diagnostic features include open-load detection that operates while outputs are in the off state, which prevents hazards due to failures such as wire breaks. In addition, current limiting with non-dissipative cut-off shuts down the output stage after a user-selectable period in the event of over-current. An external resistor determines the limiting period, and restart is attempted automatically.
 
In order to ensure quick response even with inductive loads (such as motors), ST’s new power switch integrates a smart architecture for fast demagnetization feature based on a single external clamp diode shared between the four channels.
 
Further diagnostic features include two common open-drain pins for indicating open-load and overload/thermal-shutdown, and four input/output open-drain pins for per channel overload/thermal-shutdown signalization.
 
An extensive ecosystem supports the IPS4260L as a member of ST’s extensive family of intelligent power switches. It includes a dedicated graphical user interface (STSW-IFP029GUI) for configuring the device, a detailed user manual (UM2297), and the STEVAL-IFP029V1 highly developed evaluation board. The board meets international safety standards for industrial equipment, with galvanic isolation between logic and power stages, reverse-polarity protection, and compliance with EMC regulations and IEC61000-4 specifications.
 
The IPS4260L is in production now, in miniaturized HTSSOP20 Thermally Enhanced Thin Shrink Small-Outline Package, priced from $1.58 for orders of 1000 pieces.
 
For further information, please visit www.st.com/ips.

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Electrical Connectors for Hermetically Sealed Applications
Sponsored by Mouser Electronics and Bel
Many hermetic chambers today require electrical pathways to provide internal equipment with power, data or signals, or to receive data and signals from equipment within the chamber. In this episode of Chalk Talk, Amelia Dalton and Brad Taras from Cinch Connectivity Solutions explore the role that seals and connectors play in the performance of hermetic chambers. They examine the methodologies to determine hermetic seal leaks, the benefits of epoxy hermetic seals, and how Cinch Connectivity’s epoxy-based seals and hermetic connectors can add value to your next design.
Aug 22, 2023
29,574 views