industry news
Subscribe Now

GOWIN Semiconductor Announces their GoAI Solution for AI Acceleration at the Edge

SAN JOSE, Calif. and GUANGZHOU, China, Sept. 16, 2019 (GLOBE NEWSWIRE) — GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, announces the release of its latest solution called GoAI, providing acceleration for artificial intelligence at the edge on GOWIN FPGAs. GOWIN GoAI offers a 78x performance gain over standard microcontrollers with complete design flow support into existing AI and machine learning development tools.

Adoption of artificial intelligence for edge and IoT applications is dramatically increasing to make intelligent decisions in low cost, power and form factor products without web connectivity. GoAI provides full stack support to easily test and deploy AI inference solutions at the edge by connecting into existing Caffe and Arm CMSIS-NN frameworks. This allows users to train and test a model, quantize and retest the trained model on a microcontroller within the GOWIN FPGA and then accelerate their model in FPGA fabric to enable real-time performance.

“Many edge AI solutions create roadblocks for developers by requiring proprietary software to deploy trained networks on the FPGA,” said Grant Jennings, Director of International Marketing for GOWIN Semiconductor. “By connecting into existing software frameworks for quantization and optimization we enable easier and more productive development of AI inference solutions for our customers along with better scaling across GOWIN FPGA products. This results in faster time to market and better collaborative development with more options to balance cost and performance in the end product.”

GOWIN’s GoAI accelerator provides an AHB interface, which allows customers to control the accelerator with a state machine, a soft processor or a hardened Arm Cortex-M3 processor. It also provides easier connectivity with FPGA fabric allowing developers to connect the accelerator to various interfaces such as a MIPI CSI-2 camera or various I2S microphones.

“Due to strict area and computational power requirements, edge AI applications require highly flexible domain-specific frameworks,” said Dr. Jianhua Liu, Director of Software Engineering for GOWIN Semiconductor. “GoAI combines an embedded processor with a highly flexible FPGA accelerator that seamlessly fits into popular AI frameworks enabling unique, fast and efficient AI development for broad edge applications as a result.”

GOWIN’s GoAI solution will be demonstrated at ARM Techcon 2019. The demonstration shows detection of various objects from an Omnivision camera connected to the GOWIN FPGA. The FPGA uses a neural network trained with the CIFAR10 dataset and configured within the GoAI accelerator to provide immediate inference results.

About GOWIN Semiconductor Corp.

Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.

For more information about GOWIN, please visit www.gowinsemi.com

Copyright 2019 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email info@gowinsemi.com

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

PIC32CX-BZ2 and WBZ451 Multi-Protocol Wireless MCU Family
Sponsored by Mouser Electronics and Microchip
In this episode of Chalk Talk, Amelia Dalton and Shishir Malav from Microchip explore the benefits of the PIC32CX-BZ2 and WBZ45 Multi-protocol Wireless MCU Family and how it can make IoT design easier than ever before. They investigate the components included in this multi-protocol wireless MCU family, the details of the software architecture included in this solution, and how you can utilize these MCUs in your next design.
May 4, 2023
40,786 views