industry news
Subscribe Now

Glass Bubbles from 3M Help Enable Designers to create Faster, More Reliable 5G Infrastructure and Devices

  • Small, lightweight high speed high frequency additive for 5G electronics substrates and assembly composites
  • Lower dielectric constant of any known materials additive – helps reduce signal transmission power loss and interference
  • Helps designers lower substrate materials costs

ST. PAUL, Minn. Aug. 17, 2021. 3M (NYSE: MMM) is introducing Glass Bubbles from 3M for 5G, the newest member of its high-strength hollow glass bubbles product line, provides a unique, low-loss high speed high frequency (HSHF) resin additive for composite materials that designers  use to build 5G devices and assemblies. 3M Glass Bubbles help designers enable products that can meet the rigorous transmission requirements and increased power demands that come with 5G implementation, while lowering the per volume cost of raw materials. 

3M Glass Bubbles for 5G help enable designers of HSHF copper clad laminate (CCL) to produce smooth, lightweight 5G substrates for building printed circuit boards (PCBs) – the building blocks for 5G wireless radio systems. They can also be used in plastic composites that a 5G signal transfers through, such as base station assemblies, radome shells, or even mobile phone cases.  

Signal loss and interference have always been a factor in PCB manufacturing and will become more challenging as 5G networks operate at higher signal frequencies. Using 3M Glass Bubbles as a resin additive in the CCL helps control dielectric properties, allowing design engineers to reduce signal transmission loss at higher frequencies and improves signal reliability. 3M Glass Bubbles have one of the lowest dielectric constants of any known materials additive, making it attractive for the electronics industry.

“3M Glass Bubbles have been used for more than 50 years and recent innovation has enabled the design of a bubble targeting the unique needs of 5G electronics. Our new 3M Glass Bubbles were designed specifically for 5G to help improve data transfer speeds in higher frequency applications,“ said Brian Meyer, President of Advanced Materials Division. “3M is committed to the 5G space, and we’re excited to apply our science where it matters most, collaborating on the low-loss materials needed to help designers with their higher speed wireless communications challenges now and in the future.” 

Blending in 3M Glass Bubbles for 5G HSHF CCL can also help designers lower their substrate materials costs by displacing typically higher cost resins.  Further, lightweight 3M Glass Bubbles occupy up to 20 times more space compared to the typical solid mineral fillers. Considering the cost per unit volume (instead of price per lb. or kg), 3M Glass Bubbles are a cost-effective choice in many applications. 

“3M Glass Bubbles are already being used by 5G CCL and PCB customers around the world,  supported by 3M’s global manufacturing, R&D, and application support,” said Andrew D’Souza, global 3M Glass Bubbles lab manager. “Current products target the sub-6GHz range and we are working on next generation glass bubbles solutions that are targeting even higher frequencies.”

For more information regarding 3M Glass Bubbles, visit 

3M is a trademark of 3M.

About 3M 

At 3M, we apply science in collaborative ways to improve lives daily as our employees connect with customers all around the world. Learn more about 3M’s creative solutions to global challenges at or on Twitter @3M or @3MNews.


Leave a Reply

featured blogs
Sep 16, 2021
I was quite happy with the static platform I'd created for my pseudo robot heads, and then some mad impetuous fool suggested servos. Oh no! Here we go again......
Sep 16, 2021
CadenceLIVE, Cadence's annual user conference, has been a great platform for Cadence technology users, developers, and industry experts to connect, share ideas and best practices solve design... [[ Click on the title to access the full blog on the Cadence Community site. ]]...
Sep 15, 2021
Learn how chiplets form the basis of multi-die HPC processor architectures, fueling modern HPC applications and scaling performance & power beyond Moore's Law. The post What's Driving the Demand for Chiplets? appeared first on From Silicon To Software....
Aug 5, 2021
Megh Computing's Video Analytics Solution (VAS) portfolio implements a flexible and scalable video analytics pipeline consisting of the following elements: Video Ingestion Video Transformation Object Detection and Inference Video Analytics Visualization   Because Megh's ...

featured video

Accurate Full-System Thermal 3D Analysis

Sponsored by Cadence Design Systems

Designing electronics for the data center challenges designers to minimize and dissipate heat. Electrothermal co-simulation requires system components to be accurately modeled and analyzed. Learn about a true 3D solution that offers full system scalability with 3D analysis accuracy for the entire chip, package, board, and enclosure.

Click here for more information about Celsius Thermal Solver

featured paper

3 key design decisions for any desktop 3D printer design

Sponsored by Texas Instruments

Learn about three important design considerations to take your 3D print design to the next level.

Click to read more

featured chalk talk

Fundamentals of ESD/TVS Protection

Sponsored by Mouser Electronics and Nexperia

ESD protection is a critical, and often overlooked design consideration in many of today’s systems. There is a wide variety of solutions available for ESD protection, and choosing the right one for your design can be a daunting and confusing task. In this episode of Chalk Talk, Amelia Dalton chats with Tom Wolf of Nexperia about choosing the right ESD protection for your next design.

Click here for more information about Nexperia PCMFxUSB3B/C - CMF EMI filters with ESD Protection