industry news
Subscribe Now

E-PEAS Demonstrates Complete Extremely Low Power System Leveraging its New MCU Technology

5th January 2022 – Acknowledged pioneer in power technology for energy harvesting, e-peas will be showcasing its latest engineering advances at this year’s CES event, and illustrating how they can be applied to real-world scenarios. As well as featuring some of the highly efficient energy harvesting ICs from e-peas’ award-winning AEM series, the company’s new EDMS microcontroller unit (MCU) will also be demonstrated.

Visitors to the e-peas booth at CES (#61225) will be able to see a complete ultra-low power system deployment in action. The energy autonomous surveillance system on display will rely on energy harvesting to meet all its power requirements. It may be used for people counting and facial recognition purposes (accessing stored data to confirm individual’s identities).

To power itself, the system relies on the AEM10941 PMIC, which is designed specifically for energy harvesting power management in solar-oriented implementations, plus the AEM30940 PMIC, which is intended for RF-based energy harvesting work.

At the heart of this demonstration will be the game-changing EDMS105N MCU, which e-peas is due to start sampling very soon. This 32-bit device is based on ARM Cortex-M0 architecture and is optimized for operation in situations where there are minimal available power reserves – such as industrial IoT, building automation and smart city implementations.

Further e-peas innovations are highlighted in relation to both the image sensor and the RF energy harvesting antenna employed.

“Our CES demonstration will give us the opportunity to provide an international audience with more details on the full breadth of our product offering, as it continues to expand and develop,” states Geoffroy Gosset, CEO and co-founder of e-peas. “It will underline our capacity to serve the market with comprehensive solutions for battery-free infrastructure, covering not only the power management, but also the data processing and sensing aspects. This signifies another important step in e-peas’ progression as the leader in energy autonomous edge processing and sensing applications.”

About e-peas:
e-peas develops and markets disruptive ultra-low power semiconductor technology which enables industrial and IoT wireless product designers to substantially extend battery lifespans and eliminate the heavy call-out costs of replacing batteries, without in any way compromising on reliability. Relying on 15 years of research and patented intellectual property, the company’s products increase the amount of harvested energy and drastically reduce the energy consumption of all power consuming blocks within wireless sensor nodes. Headquartered in Mont-Saint-Guibert, Belgium, with additional offices in Switzerland and the USA, e-peas offers a portfolio of energy harvesting power management interface ICs, microcontrollers and sensor solutions. www.e-peas.com

Leave a Reply

featured blogs
May 26, 2022
Introducing Synopsys Learning Center, an online, on-demand library of self-paced training modules, webinars, and labs designed for both new & experienced users. The post New Synopsys Learning Center Makes Training Easier and More Accessible appeared first on From Silico...
May 25, 2022
The Team RF "μWaveRiders" blog series is a showcase for Cadence AWR RF products. Monthly topics will vary between Cadence AWR Design Environment release highlights, feature videos, Cadence... ...
May 25, 2022
There are so many cool STEM (science, technology, engineering, and math) toys available these days, and I want them all!...
May 24, 2022
By Neel Natekar Radio frequency (RF) circuitry is an essential component of many of the critical applications we now rely… ...

featured video

EdgeQ Creates Big Connections with a Small Chip

Sponsored by Cadence Design Systems

Find out how EdgeQ delivered the world’s first 5G base station on a chip using Cadence’s logic simulation, digital implementation, timing and power signoff, synthesis, and physical verification signoff tools.

Click here for more information

featured paper

Reduce EV cost and improve drive range by integrating powertrain systems

Sponsored by Texas Instruments

When you can create automotive applications that do more with fewer parts, you’ll reduce both weight and cost and improve reliability. That’s the idea behind integrating electric vehicle (EV) and hybrid electric vehicle (HEV) designs.

Click to read more

featured chalk talk

Faster, More Predictable Path to Multi-Chiplet Design Closure

Sponsored by Cadence Design Systems

The challenges for 3D IC design are greater than standard chip design - but they are not insurmountable. In this episode of Chalk Talk, Amelia Dalton chats with Vinay Patwardhan from Cadence Design Systems about the variety of challenges faced by 3D IC designers today and how Cadence’s integrated, high-capacity Integrity 3D IC Platform, with its 3D design planning and implementation cockpit, flow manager and co-design capabilities will not only help you with your next 3D IC design.

Click here for more information about Integrity 3D-IC Platform from Cadence Design Systems