CARY, NC– June 22, 2016 – Coventor®, Inc., the leading supplier of automated software solutions for semiconductor devices and micro-electromechanical systems (MEMS), today announced the availability of SEMulator3D® 6.1 – the latest version of its semiconductor virtual fabrication platform. This new version further increases the accuracy of the process simulation, geometry and modeling of advanced semiconductor processes with new features and usability enhancements. Along with SEMulator3D Version 6.1, Coventor is releasing an all-new SEMulator3D Analytics add-on component that automates statistical analysis of process variation directly from within the SEMulator3D process-predictive platform.
SEMulator3D Analytics Module
In semiconductor device fabrication, the various processing steps have grown increasingly complex as smaller semiconductor feature sizes and nodes are developed. With shrinking process technologies, variability in unit process behavior can have a significant impact on device structure, device performance, defect modes and ultimate yield. SEMulator3D Analytics automates statistical analysis of process variation so that users can better understand the potential impact of statistical process variation on device performance and yield. The new Analytics user interface guides users in the design, execution and analysis of large statistical experiments using various techniques, including Monte-Carlo process analysis.
“The real break-through here is our ability to drive technology yield ramp actions by optimizing process steps and process variation in a statistical environment. Important process parameters can be statistically analyzed to identify areas of concern with structural measurements, yield checks and electrical specifications” said David Fried, CTO of Coventor. “Now, our users can automate the large statistical design of experiments (DOEs) for virtual fabrication, to minimize critical defects and maximize device performance and yield.”
New Modeling Capabilities in SEMulator3D 6.1
SEMulator3D 6.1 enables accurate modeling and performance prediction for next-generation processes including FinFETs, 3D NAND Flash, BEOL, Nanowires, 3D-IC, FDSOI, and DRAM.
The new version of SEMulator3D features several new process modeling capabilities, including:
- Complex sidewall patterns can now be made using a flexible “Profile Sweep” function. This new feature can be used to quickly create complex, 3D sidewall, resist and etch profiles.
- A new etch model captures heterogeneous crystalline/amorphous etches
- A new lithography model captures more realistic on-chip feature patterns
SEMulator3D 6.1 also features a new unified user-interface, with all major software components captured within a single application window, and a process file locking and encryption system which allows customers to control access to their sensitive process data.
Coventor, Inc. is the market leader in automated design solutions for developing semiconductor process technology, as well as micro-electromechanical systems (MEMS). Coventor serves a worldwide customer base of integrated device manufacturers, memory suppliers, fabless design houses, independent foundries, and R&D organizations. Its SEMulator3D modeling and analysis platform is used for fast and accurate ‘virtual fabrication’ of advanced manufacturing processes, allowing engineers to understand manufacturing effects early in the development process and reduce time-consuming and costly silicon learning cycles. Its MEMS design solutions are used to develop MEMS-based products for automotive, aerospace, industrial, defense, and consumer electronics applications, including smart phones, tablets, and gaming systems. The company is headquartered in Cary, North Carolina and has offices in California’s Silicon Valley; Waltham, Massachusetts; and Paris, France. More information is available at http://www.coventor.com.