industry news
Subscribe Now

CEVA SensPro™ Sensor Hub DSP Achieves Automotive Safety Compliant Certification for ASIL B (Random) and ASIL D (Systematic)

Functional safety-certified DSP and comprehensive software development kit is ideal for the development of low power automotive sensor fusion SoCs to process and fuse data from cameras, radar, lidar and more for autonomous driving and advanced driver assistance systems (ADAS) applications

ROCKVILLE, MD, November 23, 2021 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and integrated IP solutions, today announced that its SensPro™ sensor hub DSP IP has achieved Automotive Safety Integrity Level B random fault and ASIL D systemic fault-compliant certification. SensPro has already been licensed by multiple leading automotive semiconductor players for next-generation automotive SoCs. As an automotive IP supplier, the SensPro safety certification reflects the company’s commitment to a safety-focused design methodology for its processors, tools and software targeting automotive applications.

The ISO 26262-compliant functional safety standard’s ASIL certification is essential for automotive systems-on-chip (SoCs) used in safety critical applications such as autonomous driving and advanced driver assistance systems (ADAS) applications. The high performance SensPro sensor hub DSP is designed to process and fuse data from multiple sensors, including cameras, radar and lidar, in a highly power-efficient manner. SensPro also offers a combination of high performance single and half precision floating-point math for powertrain and Radar applications along with a large amount of 8- and 16-bit parallel processing capacity required for deep neural network (DNN) inference processing. SensPro is accompanied by an advanced set of software libraries, dedicated instruction sets (ISA) and development tools to expedite system design for automotive applications.

SensPro’s ASIL certification is based on SGS-TÜV Saar’s comprehensive audit and assessment of the functional safety development flow in accordance with the ISO 26262:2018 standard and can be found on the SGS-TÜV website.

Wolfgang Ruf, head of Functional Safety for Semiconductors at SGS-TÜV Saar, commented: “The certification of CEVA’s SensPro sensor hub DSP for ASIL D systematic and ASIL B random compliance provides their customers with high confidence that their automotive SoCs can achieve automotive safety compliance.”

Ran Snir, Vice President and General Manager of the Vision Business Unit at CEVA, commented: “CEVA has been committed to providing high-performance DSPs and comprehensive SDKs for automotive applications for more than a decade. We are pleased to achieve functional safety certification for our latest SensPro sensor hub DSPs in collaboration with SGS-TÜV Saar. The scalable SensPro architecture is ideal for increasingly sophisticated ADAS processors that handle and fuse data from a variety of vehicle sensors and having it certified for these functions enables designers to develop performance-leading ISO 26262-compliant automotive SoCs.”

Availability
The safety-compliant SensPro sensor hub DSP is available for licensing today. For more information, visit: https://www.ceva-dsp.com/product/ceva-senspro/.

About CEVA, Inc.
CEVA is the leading licensor of wireless connectivity and smart sensing technologies and integrated IP solutions for a smarter, safer, connected world. We provide Digital Signal Processors, AI engines, wireless platforms, cryptography cores and complementary software for sensor fusion, image enhancement, computer vision, voice input and artificial intelligence. These technologies are offered in combination with our Intrinsix IP integration services, helping our customers address their most complex and time-critical integrated circuit design projects. Leveraging our technologies and chip design skills, many of the world’s leading semiconductors, system companies and OEMs create power-efficient, intelligent, secure and connected devices for a range of end markets, including mobile, consumer, automotive, robotics, industrial, aerospace & defense and IoT.

Our DSP-based solutions include platforms for 5G baseband processing in mobile, IoT and infrastructure, advanced imaging and computer vision for any camera-enabled device, audio/voice/speech and ultra-low-power always-on/sensing applications for multiple IoT markets. For sensor fusion, our Hillcrest Labs sensor processing technologies provide a broad range of sensor fusion software and inertial measurement unit (“IMU”) solutions for markets including hearables, wearables, AR/VR, PC, robotics, remote controls and IoT. For wireless IoT, our platforms for Bluetooth (low energy and dual mode), Wi-Fi 4/5/6 (802.11n/ac/ax), Ultra-wideband (UWB) and NB-IoT are the most broadly licensed connectivity platforms in the industry.

Visit us at www.ceva-dsp.com and follow us on Twitter, YouTube, Facebook, LinkedIn and Instagram.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Improving Chip to Chip Communication with I3C
Sponsored by Mouser Electronics and Microchip
In this episode of Chalk Talk, Amelia Dalton and Toby Sinkinson from Microchip explore the benefits of I3C. They also examine how I3C helps simplify sensor networks, provides standardization for commonly performed functions, and how you can get started using Microchips I3C modules in your next design.
Feb 19, 2024
9,414 views