industry news
Subscribe Now

Cadence Announces Legato Memory Solution, Industry’s First Integrated Memory Design and Verification Solution

Delivers up to 2X runtime improvement compared to existing point tool solutions

SAN JOSE, Calif., September 7, 2017—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the Cadence® Legato™ Memory Solution, the industry’s first integrated solution for memory design and verification. The Legato Memory Solution eliminates the complexity of piecing together point tools for multiple design and verification tasks and can lead to productivity gains of up to 2X when compared with previous point tool offerings. To learn more about the Cadence Legato Memory Solution, please visit www.cadence.com/go/memorysolution.

The first-of-its-kind Legato Memory Solution’s cohesive design environment automates design steps and lets customers use the innovative Cadence toolset to deliver products to market faster. The solution includes new patent-pending Cadence Super Sweep technology that utilizes existing simulation databases for multi-corner and Monte Carlo analysis, allowing customers to improve both runtime and simulation throughput.
The technology capabilities included with the Cadence Legato Memory Solution improve overall design productivity and are as follows:

•       Bitcell design and verification environment: Customers can design the bitcell, including variation analysis, without ever having to leave the design environment.

•       Memory compiler design and verification environment: Customers can design and verify full memory arrays within the Legato Memory Solution and access the new Super Sweep technology to maximize accuracy and simulation throughput for advanced-node designs.

•       Memory characterization environment: Customers can create Liberty format models of the memory for system-on-chip (SoC) full-chip analysis. The tight integration between memory characterization and circuit simulation provides additional accuracy and performance improvements that can’t be achieved by point tools.

“As a world-leading supplier of System-on-Chip solutions, focused on imaging, networking and computing technologies that drive a wide variety of applications, it is critical that we accurately simulate memory instances to minimize area and power consumption of System-on-Chip,” said Yoshifumi Okamoto, corporate executive vice president & CTO at Socionext. “Through our use of the Cadence Legato Memory Solution, we have experienced a 2X productivity gain when compared with our point solution and successfully taped out 12nm memory macro designs for our System-on-Chip solutions, and we can confirm good correlation between simulation result and silicon measurement.”

“Long simulation times and a high rate of inaccuracy have become bottlenecks in the SoC design cycle schedule,” said Tom Beckley, senior vice president and general manager of the Custom IC & PCB Group at Cadence. “The new Legato Memory Solution combines patented technologies interleaved with our existing, proven Virtuoso® Liberate™ MX Memory Characterization Solution, Spectre® eXtensive Partitioning Simulator (XPS) and Virtuoso Variation Analysis solutions to improve designer productivity and enable our customers to meet stringent design schedules.”

About Cadence
Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s System Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine’s 100 Best Companies to Work For. Learn more at cadence.com.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

GaN Solutions Featuring EcoGaN™ and Nano Pulse Control
In this episode of Chalk Talk, Amelia Dalton and Kengo Ohmori from ROHM Semiconductor examine the details and benefits of ROHM Semiconductor’s new lineup of EcoGaN™ Power Stage ICs that can reduce the component count by 99% and the power loss of your next design by 55%. They also investigate ROHM’s Ultra-High-Speed Control IC Technology called Nano Pulse Control that maximizes the performance of GaN devices.
Oct 9, 2023
25,758 views