industry news
Subscribe Now

Avnet Announces Strategic Collaboration with Infineon to Deliver Cutting-Edge Silicon Carbide Technologies

06/15/2021 — PHOENIX – Leading global technology solutions provider Avnet (Nasdaq: AVT)  is working closely with Infineon on the manufacturer’s leading-edge silicon carbide (SiC) based CoolSiC™ technology, which delivers key benefits for engineers designing advanced power systems across a wide selection of market sectors and applications. Infineon and Avnet will collaborate over the next year and beyond to accelerate the deployment of energy-efficient power devices with CoolSiCTM technologies.

There is strong global demand for improved, smaller and more cost-effective power conversion systems, especially for the fast-growing market for electric vehicles. Silicon carbide delivers many important advantages over the traditional use of silicon, including higher voltage operation, wider operating temperature ranges and higher switching frequencies. Infineon’s CoolSiCTM technology builds upon these inherent advantages of the semiconductor material to deliver efficiency and reliability across a variety of applications such as battery charging, photovoltaic inverters, motor drives, energy storage and power supplies. The CoolSiCTM portfolio ranges from SiC-based diodes and discrete MOSFETs to hybrid and full SiC modules.

As part of the cooperation between the two companies, Avnet is selling an exclusive entry-level evaluation board (EVAL-1ED3122MC12H-SiC) from Infineon that is designed to provide engineers and developers with a simple way to quickly try out the possibilities of the advanced CoolSiCTM technology. The board is ready for use to evaluate the performance of the 650V or 1200V CoolSiCTM MOSFETs, which will require soldering to the board depending on the user application. The two companies are also offering extensive training programs for engineers designing power systems.

Key features of the new Infineon board include the CoolSiCTM MOSFETs organized in a half-bridge configuration, along with onboard optimized 1ED-X3 family of single-channel galvanically isolated 10A gate drivers, and isolated power supply circuitry to provide the required voltages.

“The SiC market is expected to grow at a CAGR of 30 percent over the next 5 years. Infineon is dedicated to participating in this growth for SiC technology leveraging distribution channels that share the same ambition,” said PY Ferrard, Corporate Vice President Distribution & EMS at Infineon. “And we anticipate that Avnet can be a cornerstone of our strategy to realize our goals for our CoolSiC portfolio, which provides designers with the ability to realize ever-lower costs and higher efficiency in power conversion systems in fast-growing markets and applications.”

“It speaks volumes that Infineon, a world leader in silicon carbide and power technologies, has chosen Avnet as its first distributor to run a dedicated program on CoolSiC technology,” said Tony Roybal, president Avnet Americas. “It is a clear demonstration of both our know-how and the global reach of Avnet in critically important power electronics applications.”

Learn more about Avnet’s and Infineon’s joint CoolSiCTM initiative.

About Avnet

As a leading global technology distributor and solutions provider, Avnet has served customers’ evolving needs for an entire century. We support customers at each stage of a product’s lifecycle, from idea to design and from prototype to production. Our unique position at the center of the technology value chain enables us to accelerate the design and supply stages of product development so customers can realize revenue faster. Decade after decade, Avnet helps its customers and suppliers around the world realize the transformative possibilities of technology. Learn more about Avnet at www.avnet.com.

Leave a Reply

featured blogs
Jul 22, 2021
The HotFix 019 (QIR 3, indicated as 2021.1 in the application splash screens) update for OrCAD® and Allegro® is now available at Cadence Downloads . This blog post contains important links... [[ Click on the title to access the full blog on the Cadence Community si...
Jul 21, 2021
It's a funny old thing to find yourself in possession of a USB-C dock when you don't have a host machine that sports a USB-C connector with which to drive it....
Jul 21, 2021
We explain how virtual prototyping eliminates ASIC design bugs before RTL, and how chip architecture design modeling correlates key performance attributes. The post Take the Guesswork Out of Designing Your New Product Architecture appeared first on From Silicon To Software....
Jul 9, 2021
Do you have questions about using the Linux OS with FPGAs? Intel is holding another 'Ask an Expert' session and the topic is 'Using Linux with Intel® SoC FPGAs.' Come and ask our experts about the various Linux OS options available to use with the integrated Arm Cortex proc...

featured video

Electromagnetic Analysis for High-Speed Communication

Sponsored by Cadence Design Systems

When your team is driving the future of breakthrough technologies like autonomous driving, industrial automation, and healthcare, you need software that helps meet approaching deadlines and increasingly high-performance demands. Learn how a system analysis solution can provide accurate 3D modeling, electromagnetic simulation, and electrothermal simulation at the chip, package, PCB, and system level.

Click to learn more

featured paper

Configure the charge and discharge current separately in a reversible buck/boost regulator

Sponsored by Maxim Integrated

The design of a front-end converter can be made less complicated when minimal extra current overhead is required for charging the supercapacitor. This application note explains how to configure the reversible buck/boost converter to achieve a lighter impact on the system during the charging phase. Setting the charge current requirement to the minimum amount keeps the discharge current availability intact.

Click to read more

featured chalk talk

Meet the Latest Wireless Member of the DARWIN Family

Sponsored by Mouser Electronics and Maxim Integrated

May 21, 2021 -- Your next MCU needs to be more than just smart. It needs to be power-efficient, have ample memory, and industrial-grade security. In this episode of Chalk Talk, Amelia Dalton chats with Zach Metzinger of Maxim Integrated about the latest member of the DARWIN family with a new RISC-V co-processor.

Click here for more information about Maxim Integrated MAX32655 Low-Power Wireless Microcontroller