industry news
Subscribe Now

Alliance Memory Launches New LPSRAMs With Embedded Error-Correction Code

1Mb and 4Mb Devices Boost Reliability Over Previous Generation Devices

KIRKLAND, Wash., Jan. 25, 2023 (GLOBE NEWSWIRE) — Alliance Memory today announced that the company has expanded its portfolio of low power asynchronous SRAM (LPSRAM) products with new 1Mb and 4Mb devices that feature embedded error-correction code (ECC). Compared to previous generation devices, the new AS6CE1016A (1Mb) and AS6CE4016B (4Mb) offer better failure in time (FIT) and mean time to failure (MTTF) characteristics with reduced soft error rates (SER) for more reliable operation in a wide range of consumer, industrial, communications, and medical applications.

The new LPSRAMs’ ECC feature provides 1-bit error correction per byte, which makes them particularly suitable for low power applications and battery backup nonvolatile memory applications. Data retention voltage for both devices is 1.5V with typical data retention current of 1µA for the 1Mb AS6CE1016A and 2µA for the 4Mb AS6CE4016B. The devices operate from a single power supply of 2.7V to 3.6V, and all inputs and outputs are fully TTL compatible.

With their enhanced performance, the new LPSRAMs are designed to meet the demands of a very wide range of applications, such as routers and switches in communications systems; programmable logic controllers in industrial automation systems; printers, gaming machines, musical instruments, and calculators; vending machines and ATMs; and elevator systems, control panels, and fire control systems.

Key device specifications and package options are shown in the table below.

Device Specification Table:

Part number Organization VCC range Access
time
Operating
temperature
Package
AS6CE4016B-45ZIN 256K x 16 2.7 – 3.6V 45 ns -40 ~ 85°C 44-pin 400 mil TSOP II
AS6CE4016B-45BIN 256K x 16 2.7 – 3.6V 45 ns -40 ~ 85°C 48-ball 6mm x 8mm FBGA
AS6CE1016A-45ZIN 64K x 16 2.7 – 3.6V 45 ns -40 ~ 85°C 44-pin 400 mil TSOP II

Samples and production quantities of the AS6CE1016A (1Mb) and AS6CE4016B (4Mb) are in stock and available now.

About Alliance Memory Inc.
Alliance Memory is a worldwide provider of critical and hard-to-find memory ICs for the communications, computing, consumer electronics, medical, automotive, and industrial markets. The company’s product range includes flash, DRAM, and SRAM memory ICs with commercial, industrial, and automotive operating temperature ranges and densities from 64Kb to 8GB. Privately held, Alliance Memory maintains headquarters in Kirkland, Washington, and regional offices in Europe, Asia, Canada, and South America. More information about Alliance Memory is available online at www.alliancememory.com.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Nexperia Energy Harvesting Solutions
Sponsored by Mouser Electronics and Nexperia
Energy harvesting is a great way to ensure a sustainable future of electronics by eliminating batteries and e-waste. In this episode of Chalk Talk, Amelia Dalton and Rodrigo Mesquita from Nexperia explore the process of designing in energy harvesting and why Nexperia’s inductor-less PMICs are an energy harvesting game changer for wearable technology, sensor-based applications, and more!
May 9, 2023
40,873 views