industry news
Subscribe Now

64-Channel High-Voltage Switch IC from STMicroelectronics Drives Portability with Performance in Medical and Industrial Imaging

Geneva, October 15, 2019 — STMicroelectronics’ 64-channel high-voltage analog-switch IC delivers unprecedented integration for advanced ultrasound systems, probes, piezoelectric drivers, automated test equipment, industrial automation, and process-control systems.

The STHV64SW comprises a shift register for logic control signals, self-biased high-voltage MOSFET gate drivers, and N-channel MOSFET switches capable of providing up to ±3A peak output current. The switches respond quickly, with 1.5µs turn-on time, and low quiescent current saves power when turned off. Low on-resistance with low distortion and crosstalk ensure high signal integrity. Thermal shutdown and under-voltage lockout (UVLO) are built-in to ensure safe operation.

ST has created this advanced device leveraging proprietary BCD6s-SOI (silicon on insulator) and BCD8s SOI process technologies to combine precise analog circuitry (Bipolar), low-voltage CMOS logic, and robust DMOS power stages on the same chip. The STHV64SW can operate with various combinations of high-voltage supplies up to -100V/+100V, 0V/200V, or -200V/0V.

The STHV64SW has already been designed into innovative high-tech equipment such as ultrasonic flaw detectors for industrial non-destructive testing (NDT), as well as into affordable and portable handheld medical echography devices that are raising standards of pre-natal care available to remote and rural communities.

The highly integrated 64channel analog-switch IC comes in a small FCBGA package as does the recently announced companion 16-pulser STHV1600 IC, enabling system manufacturers to increase channel density for superior ultrasound image resolution, using minimal board space.

The STHV64SW is available now, packaged as a BGA-196 device, from $45.00 for orders of 1000 pieces. The STEVAL-IME015V1 evaluation board is also available, for orders please contact your ST sales office.
Please visit sthw64sw-pr for further information.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Package Evolution for MOSFETs and Diodes
Sponsored by Mouser Electronics and Vishay
A limiting factor for both MOSFETs and diodes is power dissipation per unit area and your choice of packaging can make a big difference in power dissipation. In this episode of Chalk Talk, Amelia Dalton and Brian Zachrel from Vishay investigate how package evolution has led to new advancements in diodes and MOSFETs including minimizing package resistance, increasing power density, and more! They also explore the benefits of using Vishay’s small and efficient PowerPAK® and eSMP® packages and the migration path you will need to keep in mind when using these solutions in your next design.
Jul 10, 2023
32,430 views