industry news
Subscribe Now

Artesyn Extends ControlSafe™ SIL4 COTS Rail Computing Platform to Onboard Applications

Washington D.C. [11 April, 2017] — At the SafeRail Congress today, Artesyn Embedded Technologies has unveiled the latest in its portfolio of SIL4 COTS computing systems for rail safety applications, the ControlSafe™ Carborne Platform. Designed for onboard applications such as automatic train protection (ATP), automatic train operation (ATO), and positive train control (PTC), the new platform can also be used in wayside train control and rail signaling implementations. The ControlSafe™ Carborne Platform leverages the same safety architecture and technologies as Artesyn’s ControlSafe Platform and ControlSafe Expansion Box Platform, to provide a highly integrated and cost-effective solution for rail system integrators and rail application providers. The first two platforms in the portfolio have been both certified to SIL4, while SIL4 certification of the ControlSafe Carborne Platform is anticipated to be complete in Q3 2017. 

Product photos:

https://www.artesyn.com/computing/assets/1491347373-prod0.jpg

and

https://www.artesyn.com/computing/assets/1491347373-prod1.png

Housed in a compact 4U chassis with front access I/O and a DC power supply, the ControlSafe™ Carborne Platform can accommodate up to 12 I/O modules and a variety of I/O types. An innovative data lock step architecture, used in all Artesyn ControlSafe Platforms, allows customers to make seamless technology upgrades while a hardware-based voting mechanism allows for application software transparency. Designed to meet rail functional safety, reliability and availability requirements, the ControlSafe™ Carborne Platform is ideal for deployment in safety application environments and can save customers a significant amount of time, cost and risk associated with the system development and certification process by using a COTS product.

“We have a customer who has adopted the ControlSafe Platform and estimates that they have saved millions of dollars and many years of development time,” said Qianqian Shao, marketing manager for Artesyn Embedded Technologies. “A shared safety architecture makes it easy to transfer applications between systems and deploy as a common platform. This innovative data lock-step architecture and hardware-based voting mechanism supports high performance modern processors, and is modular, scalable and designed to seamlessly accommodate additional I/O interfaces as well as new processor architectures that will be required throughout the product life cycle.”

The ControlSafe Carborne Platform is designed as a common base platform to enable a variety of applications through the integration of Artesyn IOU modules. In addition, Artesyn offers customers the flexibility to develop IOU modules and specify I/O backplane connectivity to meet their specific needs by providing all necessary technical specifications, product support and service.

Artesyn is a lead sponsor of the SafeRail Congress 2017 in Washington D.C. (April 11-12), where the company is showcasing the ControlSafe Platform portfolio on stand six.

About Artesyn Embedded Technologies

Artesyn Embedded Technologies is a global leader in the design and manufacture of highly reliable power conversion and embedded computing solutions for a wide range of industries including communications, computing, medical, military, aerospace and industrial. For more than 40 years, customers have trusted Artesyn to help them accelerate time-to-market and reduce risk with cost-effective advanced network computing and power conversion solutions. Artesyn has over 20,000 employees worldwide across ten engineering centers of excellence, four world-class manufacturing facilities, and global sales and support offices.

Artesyn Embedded Technologies, Artesyn and the Artesyn Embedded Technologies logo are trademarks and service marks of Artesyn Embedded Technologies, Inc. All other names and logos referred to are trade names, trademarks, or registered trademarks of their respective owners. © 2017 Artesyn Embedded Technologies, Inc.  All rights reserved.  For full legal terms and conditions, please visit www.artesyn.com/legal

 

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Connectivity Solutions for Smart Trailers
Smart trailers can now be equipped with a wide variety of interconnection systems including wire-to-wire, wire-to-board, and high-speed data solutions. In this episode of Chalk Talk, Amelia Dalton and Blaine Dudley from TE Connectivity explore the evolution of smart trailer technology, the different applications within a trailer where connectivity would be valuable, and how TE Connectivity is encouraging innovation in the world of smart trailer technology.
Oct 6, 2023
26,137 views