industry news
Subscribe Now

STMicroelectronics Delivers Superior-Performing NFC Technology for Secure Contactless Payments and IoT Applications

Geneva, February 21, 2017 – STMicroelectronics has announced availability of its latest-generation NFC devices for contactless payments and data exchange. The new devices include the ST21NFCD NFC controller featuring the market-proven booster technology ST has recently acquired, and two new members in the ST54 System-in-Package (SiP) family that integrate the Company’s latest Secure Element technology.

The ST21NFCD chip features active load modulation for faster, smoother transactions over longer distances, delivering better user experiences in mobiles, wearables, or IoT devices. It supports card emulation, reader/writer and peer-to-peer communication modes, and contains eFlash to permit full firmware update. It supports the NFC Forum’s NCI 2.0 specification, which simplifies software development for interacting with NFC tags and supports batching and autonomous exchanges to minimize communication overheads. The IC also meets NFC Forum type 1-5 tag specifications, ISO/IEC 18092 NFC Interface and Protocol (NFCIP), and payment standards including EMVCo latest revisions. It is pre-certified in accordance with the Global Certification Forum (GCF) and PTCRB[1] for integration in mobile devices, and can enable handsets to read MIFARE ClassicTM encrypted tags.

Built-in power management and battery-voltage monitoring minimize any impact on runtime in a host-system such as a smartphone. The extremely high RF sensitivity, which allows the use of miniaturized antennas; the option to use an external clock source instead of a crystal; and the high output power of the chip that makes the DC/DC booster optional, each help save bill of materials and board footprint.

ST’s latest ST54 Systems-in-Packages – ST54F and ST54H – contain the ST21NFCD NFC controller and an embedded Secure Element (eSE). The eSE is an ST33 secure microcontroller certified to the highest security standards including Common Criteria EAL5+ and EMVCo for financial applications, which ensures strong protection against duplication and hacking in a compact and easy-to-use integrated device. It leverages the proven ARM® SecurCore® SC300™ core and supports secure operating systems (OS) running Java Card™ and GlobalPlatform™.

The ST54F integrates the ST21NFCD with the widely deployed ST33G1M2 Secure Element with up to 1.28MB of eFlash. The ST54H embeds a more advanced ST33J2M0 Secure Element with up to 2MB eFlash and twice the performance of the ST33G1M2 to connect with new digital secure applications from service providers.

The ST21NFCD and the new ST54 SiPs are in volume production, each packaged as a 4mm x 4mm x 0.8mm 64-pin WFBGA. Please contact your ST sales office for pricing options and sample requests.

ST’s latest NFC devices will be on show at Mobile World Congress in Barcelona (Feb 27-Mar 2, Booth 7A61).

For further information please visit http://www.st.com/en/secure-mcus/secure-nfc.html

Leave a Reply

featured blogs
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Altera® FPGAs and SoCs with FPGA AI Suite and OpenVINO™ Toolkit Drive Embedded/Edge AI/Machine Learning Applications

Sponsored by Intel

Describes the emerging use cases of FPGA-based AI inference in edge and custom AI applications, and software and hardware solutions for edge FPGA AI.

Click here to read more

featured chalk talk

Improving Chip to Chip Communication with I3C
Sponsored by Mouser Electronics and Microchip
In this episode of Chalk Talk, Amelia Dalton and Toby Sinkinson from Microchip explore the benefits of I3C. They also examine how I3C helps simplify sensor networks, provides standardization for commonly performed functions, and how you can get started using Microchips I3C modules in your next design.
Feb 19, 2024
10,027 views