industry news
Subscribe Now

Latest best in class testing solutions to be showcased at DesignCon 2017 by HUBER+SUHNER

Herisau, 18 January 2017 – HUBER+SUHNER, leading manufacturer of components and systems for optical and electrical connectivity products, is set to unveil its best in class solutions for bench-top and system testing at this year’s DesignCon exhibition in Santa Clara.

The HUBER+SUHNER booth at DesignCon focuses on its range of outstanding electrical solutions and assemblies developed and enhanced for high speed digital testing. Designed to be highly flexible, with outstanding electrical characteristics and best in-class phase stability, HUBER+SUHNER solutions provide revolutionary high speed testing.

“In a world where performance, speed and density matter, innovative high speed digital testing solutions are key,” said Stéphanie Jarno, Market Manager Instrumentation at HUBER+SUHNER. “Our developments come at a time when companies are looking for high performing yet cost efficient solutions for their testing requirements, and HUBER+SUHNER’s new products address exactly these concerns.”

Displayed at the booth is MXPM, a product extension of the well received multicoax MXP product line. The small form factor and outstanding electrical characteristics combined with reliable mating and ease of use make the MXP series an excellent solution for bench-top and system testing. MXPM, the new precision multicoax connector solution, has a coaxial-to-PCB transition of up to 85 GHz, smart interface protection and an innovative locking mechanism.

“The MXPM series is a revolutionary multicoax solution in response to the most stringent testing requirements. Electrically transparent and offering a very small pitch, this solution is well suited for applications tolerating no signal integrity degradation.  Our initial product line operates up to 65GHz with a 85GHz version coming soon,” said Stéphanie.

Also at the HUBER+SUHNER booth will be the SUCOFLEX 500 series for VNA, where the new assembly – SUCOFLEX 526S – will be making its debut. HUBER+SUHNER will also be introducing the Microbend L, the brand new low loss assembly with increased phase stability and power handling capability for use in low profile and dense applications.

“We are very much looking forward to DesignCon and hope to demonstrate why HUBER+SUHNER is and will continue to be one of the industry’s most valuable and pioneering developers of efficient and reliable testing technology and solutions,” added Stéphanie Jarno.

DesignCon visitors can view the MXPM series and other HUBER+SUHNER products at Booth #847 at the Santa Clara Convention Center, Santa Clara, California on 1st and 2nd of February 2017.

To arrange a briefing or product demonstration, contact the HUBER+SUHNER team at the details below.

HUBER+SUHNER Group

HUBER+SUHNER is a global company with headquarters in Switzerland that develops and manufactures components and system solutions for electrical and optical connectivity. With cables, connectors and systems – developed from the three core technologies of radio frequency, fiber optics and low frequency – the company serves customers in the communication, transportation and industrial sectors. The products deliver high performance, quality, reliability and long life – even under harsh environment conditions. Our global production network, combined with group companies and agencies in over 60 countries, puts HUBER+SUHNER close to its customers. Further information on the company can be found at hubersuhner.com.

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

GaN Solutions Featuring EcoGaN™ and Nano Pulse Control
In this episode of Chalk Talk, Amelia Dalton and Kengo Ohmori from ROHM Semiconductor examine the details and benefits of ROHM Semiconductor’s new lineup of EcoGaN™ Power Stage ICs that can reduce the component count by 99% and the power loss of your next design by 55%. They also investigate ROHM’s Ultra-High-Speed Control IC Technology called Nano Pulse Control that maximizes the performance of GaN devices.
Oct 9, 2023
25,948 views