industry news
Subscribe Now

Synopsys Advances Test and Yield Analysis Solution for 7-nm Process Node

MOUNTAIN VIEW, Calif., Nov. 14, 2016 /PRNewswire/ —

Highlights:

  • Innovative slack-based cell-aware test for 7-nm designs increases defect coverage
  • FinFET SRAM defect modeling and test algorithms enable efficient test and repair of 7-nm memories
  • New diagnostics and yield analysis support for 7-nm reduce turnaround time

Synopsys, Inc. (Nasdaq: SNPS) today announced it expanded its test and yield analysis solution targeting FinFET-specific defects to enable higher quality testing, repair, diagnostics and yield analysis of advanced 7-nanometer (nm) SoCs. To improve defect coverage, Synopsys has been collaborating with several semiconductor companies to advance testing and diagnostics methods for logic, memory and high-speed mixed-signal circuits targeted for manufacture with 7-nm processes. These collaborations are enabling rapid deployment of new functionality within Synopsys’ synthesis-based test solution, featuring TetraMAX® II ATPG, DesignWare® STAR Memory System®, and DesignWare STAR Hierarchical System.

Leading semiconductor companies ramping up design capabilities for emerging 7-nm processes are facing increasing test quality and yield management challenges. To address these challenges, Synopsys’ test solution delivers several innovative technologies that target defects occurring more frequently at emerging process nodes. For logic circuits, new modeling techniques, such as resistance sweeping, improve the ability of slack-based cell-aware tests to detect defects such as intra-cell partial bridges that are more prevalent with advanced FinFET processes. For embedded memory test and repair, the STAR Memory System solution incorporates custom algorithms based on silicon learning at the industry’s top silicon foundries to detect and repair defects exemplified by resistive fin shorts, fin opens and gate-fin shorts. Furthermore, the DesignWare STAR Hierarchical System enables high coverage manufacturing and characterization test patterns for the 7-nm DesignWare PHY IP to be efficiently applied through the SoC hierarchy.

To accelerate diagnosis of 7-nm yield issues, defect isolation to specific areas within design cells is possible through new support of cell-aware descriptions in the database shared between TetraMAX II ATPG and Yield Explorer® solutions. The combination of test and diagnostic advances increase 7-nm defect detection and speed up failure analysis and yield ramp in production manufacturing environments.

“The growing complexity and process variation found with advanced 7-nm FinFET processes requires improved test and yield technologies,” said John Koeter, vice president of marketing for IP and prototyping at Synopsys.  “Our IP design teams are leveraging TetraMAX ATPG as well as STAR Memory System and STAR Hierarchical System test, repair and diagnostic solutions to help multiple customers designing with 7-nm IP improve their product quality and yield, while accelerating their time to market.”

“As a leading provider of comprehensive test and yield solutions, Synopsys is committed to helping designers meet their growing challenges of higher quality and faster yield ramp,” said Bijan Kiani, vice president of product marketing for the Design Group at Synopsys. “Through our on-going collaborations with leading semiconductor companies worldwide, we are delivering innovative solutions to address the specific requirements for advanced FinFET processes. These innovations will enable our customers to rapidly adopt 7-nm technologies to meet their goals for high-performance SoC products.”

About the Synopsys Synthesis-Based Test Solution

The Synopsys synthesis-based test solution comprises DFTMAX Ultra, DFTMAX, and TetraMAX I and II for power-aware logic test and physical diagnostics; DFTMAX LogicBIST for in-system self-test; SpyGlass® DFT ADV for testability analysis; the DesignWare STAR Hierarchical System for automated hierarchical testing of IP and logic blocks on an SoC; DesignWare STAR Memory System  for embedded test, repair and diagnostics; the Z01X fault simulator; Yield Explorer design-centric yield analysis; and the Camelot software system for CAD navigation. Synopsys’ test solution combines Design Compiler® RTL synthesis with embedded test technology to optimize timing, power, area and congestion for test as well as functional logic, leading to faster time-to-results. The Synopsys test solution delivers tight integration across the Synopsys Galaxy Design Platform, including Design Compiler synthesis, IC Compiler II place and route, and PrimeTime® timing analysis, to enable faster turnaround time while meeting both design and test goals, higher defect coverage and faster yield ramp.

About Synopsys

Synopsys, Inc. (Nasdaq: SNPS) is the Silicon to Software™ partner for innovative companies developing the electronic products and software applications we rely on every day. As the world’s 15th largest software company, Synopsys has a long history of being a global leader in electronic design automation (EDA) and semiconductor IP and is also growing its leadership in software security and quality solutions. Whether you’re a system-on-chip (SoC) designer creating advanced semiconductors, or a software developer writing applications that require the highest security and quality, Synopsys has the solutions needed to deliver innovative, high-quality, secure products. Learn more at www.synopsys.com.

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Optimize Performance: RF Solutions from PCB to Antenna
Sponsored by Mouser Electronics and Amphenol
RF is a ubiquitous design element found in a large variety of electronic designs today. In this episode of Chalk Talk, Amelia Dalton and Rahul Rajan from Amphenol RF discuss how you can optimize your RF performance through each step of the signal chain. They examine how you can utilize Amphenol’s RF wide range of connectors including solutions for PCBs, board to board RF connectivity, board to panel and more!
May 25, 2023
38,043 views