industry news
Subscribe Now

Registration for Worldwide MEMS Design Contest Opens

SAN JOSE, Calif., November 2, 2016—Cadence Design Systems, Inc. (NASDAQ: CDNS), Coventor, X-FAB and Reutlingen University have teamed up to launch the MEMS design contest to encourage the development of innovative MEMS and mixed-signal designs. The first-prize winner will receive a $5000 cash award, have their design manufactured at X-FAB’s wafer production facilities and get a free one-year license of Coventor’s MEMS design software. The second and third prize winners will receive $2,000 and $1,000 cash prizes respectively, along with a private tour of X-FAB’s foundry facilities. The contest registration is open until December 31, 2016, and design teams are encouraged to enter the contest at http://info.coventor.com/mems-design-contest-2018

“We are looking forward to seeing innovative, creative designs from companies, entrepreneurs, researchers and students from around the globe,” said Dr. Stephen R. Breit, vice president of engineering at Coventor. “All four organizations behind this effort are committed to furthering the integration of MEMS design, mixed-signal design and device fabrication.” 

To support contest registrants, the organizers will provide free training workshops to help participating design teams become familiar with the design tools, methodologies and process technologies needed to create their MEMS and mixed-signal designs. Participants will also receive free access to various IP blocks that can be used as part of their design such as digital SC, I/Os, RAM and ROM blocks.

The contest results will be announced, and prizes will be awarded at the annual Cadence user conference, CDNLive EMEA, in Munich, Germany, in 2018. The key dates for the contest are: 

December 31, 2016: Entry deadline 

March 1, 2017: Entry acceptance notification; design phase starts

December 31, 2017: Design submission deadline

February 28, 2018: Prize announcements 

CDNLive EMEA 2018: Awards ceremony

About the Contest Organizers

Cadence Design Systems http://www.cadence.com/ enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry. 

X-FAB http://www.xfab.com/ is the leading analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia and the U.S. X-FAB employs more than 3,800 people worldwide. 

Coventor, Inc. http://www.coventor.com/mems-solutions is the market leader in automated design solutions for developing semiconductor process technology and micro-electromechanical systems (MEMS). Coventor serves a worldwide customer base of integrated device manufacturers, memory suppliers, fabless design houses, independent foundries, and R&D organizations from its headquarters in Cary, North Carolina, and offices in Silicon Valley, California, Waltham, Massachusetts, and Paris, France. 

Reutlingen University http://www.reutlingen-university.de/ is one of Germany’s leading universities, offering international academic programs with close ties to industry and commerce. It will help formulate and organize the call for participation of the contest. 

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Altera® FPGAs and SoCs with FPGA AI Suite and OpenVINO™ Toolkit Drive Embedded/Edge AI/Machine Learning Applications

Sponsored by Intel

Describes the emerging use cases of FPGA-based AI inference in edge and custom AI applications, and software and hardware solutions for edge FPGA AI.

Click here to read more

featured chalk talk

Accessing AWS IoT Services Securely over LTE-M
Developing a connected IoT design from scratch can be a complicated endeavor. In this episode of Chalk Talk, Amelia Dalton, Harald Kröll from u-blox, Lucio Di Jasio from AWS, and Rob Reynolds from SparkFun Electronics examine the details of the AWS IoT ExpressLink SARA-R5 starter kit. They explore the common IoT development design challenges that AWS IoT ExpressLink SARA-R5 starter kit is looking to solve and how you can get started using this kit in your next connected IoT design.
Oct 26, 2023
24,375 views