industry news
Subscribe Now

congatec’s new COM Express modules with latest Intel® Celeron® processors, codenamed Skylake

San Diego, CA, May 19, 2016  * * *   congatec, a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design & manufacturing (EDM) services, increases the scalability of its COM Express Computer-on-Modules with two new entry-level models based on the latest Intel 14nm microarchitecture (formerly codename Skylake). The Intel® Celeron® processor-based COM Express Basic and Compact modules combine cost efficient dual-core CPU performance with state of the art features such as 4k multiscreen support, high-speed DDR4 RAM with increased bandwidth and four USB 3.0 ports. This significant performance increase over earlier Intel® Celeron® processor generations constitutes a giant performance leap for developers targeting the broad and particularly price-sensitive field of mid-range applications.

The key applications for the new Computer-on-Modules include all kinds of 4k multi-screen solutions in which one embedded computer module controls up to three independent screens without the need for a dedicated graphics card. Applications can be found in operating rooms and medical diagnostics terminals, HMIs in industrial machinery and facilities, digital signage, vending and retail applications as well as gaming and infotainment terminals.

The technical innovations in detail

The new COM Express Compact module conga-TC170 features the 2GHz dual-core Intel® Celeron® Processor 3955U with a configurable Thermal Design Power (cTDP) of 10-15W, which facilitates adapting the application to the energy concept of the system. The slightly larger new conga-TS170 COM Express Basic modules are available with the Intel® Celeron® Processor G3900E with 2.4GHz and 35W TDP or with the G3902E featuring 1.6 GHz and 25 W TDP. All modules support up to 32 GB of DDR4 dual channel memory which yields significantly more bandwidth and greater energy efficiency than DDR3L implementations. The Intel® Gen9 HD Graphics 510 drives up to three independent displays with 4k @ 60 Hz via DisplayPort 1.2 and DMI 2.0. For even richer Windows 10 based 3D graphics there is DirectX 12 support. Thanks to hardware-accelerated encode and decode of HEVC, VP8, VP9 and VDENC video it is for the first time possible to stream HD video energy-efficiently in both directions.

The new computer modules from congatec support the COM Express Type 6 pinout including PCI Express Gen 3.0, USB 3.0 and USB 2.0, SATA Gen 3, Gigabit Ethernet as well as low speed interfaces such as LPC, I²C and UART. The modules run Microsoft Windows 10 as well all other current Microsoft Windows and Linux operating systems. A comprehensive set of add-ons for easier design-in – such as cooling solutions, carrier boards and starter kits plus SMART battery management module – completes the congatec eco system.

For further information about the new COM Express Compact module conga-TC170 visit:

http://www.congatec.com/en/products/com-express-type6/conga-tc170.html

For further information about the new COM Express Basic module conga-TS170 visit:

http://www.congatec.com/en/products/com-express-type6/conga-ts170.html

About congatec, Inc.

congatec, Inc., with its headquarters in San Diego, California, is a leading supplier of industrial computer modules using the standard form factors Qseven, COM Express, XTX and ETX, as well as single board computers and EDM services. congatec’s products can be used in a variety of industries and applications, such as industrial automation, medical, entertainment, transportation, telecommunication, test & measurement and point-of-sale .  Core knowledge and technical know-how includes unique extended BIOS features as well as comprehensive driver and board support packages. Following the design-in phase, customers are given support via extensive product lifecycle management. The company’s products are manufactured by specialist service providers in accordance with modern quality standards. congatec, Inc. is a subsidiary of the German based company congatec AG, which has additional entities in Taiwan, the Czech Republic, Japan, China, and Australia.  More information is available on our website atwww.congatec.us or via FacebookTwitter and YouTube.

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Accessing AWS IoT Services Securely over LTE-M
Developing a connected IoT design from scratch can be a complicated endeavor. In this episode of Chalk Talk, Amelia Dalton, Harald Kröll from u-blox, Lucio Di Jasio from AWS, and Rob Reynolds from SparkFun Electronics examine the details of the AWS IoT ExpressLink SARA-R5 starter kit. They explore the common IoT development design challenges that AWS IoT ExpressLink SARA-R5 starter kit is looking to solve and how you can get started using this kit in your next connected IoT design.
Oct 26, 2023
23,987 views