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ProPlus Design Solutions Strengthens Leadership Position with Re-Innovated, Long-Lived BSIMProPlus SPICE Modeling Platform

SAN JOSE, CALIF. –– November 5, 2014 –– ProPlus Design Solutions Inc., the SPICE modeling solutions leader and provider of the first giga-scale SPICE simulator and unique Design-for-Yield (DFY) solutions, today introduced the latest release (2014.2) of the re-innovated BSIMProPlus™, the leading SPICE modeling platform for nanometer devices.

“Our goal was to continue our long-term commitment to our 100+ worldwide customers and strengthen BSIMProPlus’ leadership position with several key projects started a few years ago,” remarks Dr. Zhihong Liu, chairman and chief executive officer of ProPlus Design Solutions. “We achieved our goal, the result of our heavy investments over those years. We now offer the most powerful and complete platform for advanced technologies, including 16/14nm and beyond, with re-innovated core technologies ready for another 20 years.”

The latest release of BSIMProPlus features a new GUI with consolidated modeling flows, greatly improved usability and functionality to help increase engineer’s modeling productivity. The built-in full parallel SPICE engine provides the best modeling capabilities for both device and circuit-level model extraction and verification, and enables a unified modeling environment for all types of modeling needs. The latest release also comes with enhanced support for advanced nodes, such as 16/14 nanometer (nm) FinFET and sub-28nm FDSOI, and complete process variation modeling for various systematic, random and temporal variation effects. Testbenches have shown this release offers more than 3X greater performance for auto extraction for major models compared to previous releases.

The Most Complete, Reliable Solution for Advanced Modeling Needs

BSIMProPlus strengthens the link between nano-scale devices and giga-scale circuit designs. It is built on a foundation of vast experience with modeling flows and features accumulated for 20 years. BSIMProPlus’ production-proven accurate simulation, extraction and optimization engines have been silicon validated by more than 100 customers worldwide, including all leading foundries, top integrated device manufacturers (IDMs) and fabless companies, providing the most reliable one-stop solutions.

With the technological advancement and increasing modeling needs for more varieties of technology platforms, modeling engineers face tremendous challenges to provide accurate, complete and robust SPICE models in a short time. Several key projects were started a few years ago to re-innovate core technologies and lay the foundation for next-generation modeling needs. 

One of the key innovations is the tight integration of a full-parallel SPICE engine known as NanoSpice™, the next-generation high-capacity, high-performance parallel SPICE simulator for giga-scale circuit simulation. NanoSpice enables BSIMProPlus to efficiently handle any complicated models for all types of devices and modeling targets. For example, modeling engineers can use BSIMProPlus to generate SPICE models for SRAM by tuning parameters to fit targets at both device and SRAM cell level, such as cell read current, cell leakage or Static Noise Margin (SNM). The built-in SPICE engine also makes BSIMProPlus, for the first time, a unified modeling environment for all modeling requirements, including IV/CV, RF, 1/f and thermal noise, LDE, statistical and corner, reliability and other customized modeling.

The new BSIMProPlus also features a new GUI interface and consolidated modeling flows. The model engine has been enhanced and extended to better manage cutting-edge process technologies, such as FinFET and Fully Depleted Silicon On Insulator (FDSOI). Improvements have been made to BSIMProPlus’ extraction and optimization engines and flows to deliver much faster and accurate model extraction results.

BSIMProPlus 2014.2 is shipping now. Existing customers may be eligible for upgrade. Pricing is available upon request.

About ProPlus Design Solutions

ProPlus Design Solutions, Inc. delivers Electronic Design Automation (EDA) solutions with the mission to enhance the link between design and manufacturing. As the SPICE modeling solutions leader and leading technology provider of giga-scale SPICE simulation and design for yield (DFY) applications, it provides unique DFY solutions integrating the most advanced device modeling, a high-performance parallel SPICE simulation engine and hardware-validated variation analysis technologies. Founded in 2006, ProPlus Design Solutions has R&D centers in the San Jose, Calif., Beijing and Jinan, China, and offices in Tokyo, Japan, Hsinchu, Taiwan, and Shanghai, China. More information about ProPlus Design Solutions can be found at www.proplussolutions.com.

BSIMProPlus, Model Explorer, NanoExplorer, NanoSpice, NanoYield and NoisePro are registered trademarks of ProPlus Design Solutions. ProPlus Design Solutions acknowledges trademarks or registered trademarks of other organizations for their respective 

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