industry news
Subscribe Now

S2C Accelerates FPGA-based Prototype Development with TAI Player Pro Version 5.1

SAN JOSE, Calif. – Sept. 3, 2014 – S2C, Inc. announced today the release of TAI Player Pro version 5.1. This latest release helps to accelerate prototype development, increase engineering productivity, and achieve the maximum performance from your prototype.

“The new version of TAI Player Pro enhances the power and capability of our entire line,” said Toshio Nakama, CEO of S2C. “It’s a powerful configuration tool – we recently had a customer partition a 300 million gate design over 24 FPGAs. In addition, TAI Player Pro is a runtime tool that can monitor and control several FPGA-based platforms across the network. I’m very pleased to provide this new level of capability to our customers.” 

About TAI Player Pro

TAI Player Pro is tightly integrated with S2C’s family of Logic Module prototyping systems and provides two major functions. The first is to map a design across one or more FPGAs which includes partitioning, plus managing synthesis and FPGA P&R tools. TAI Player Pro automatically inserts LVDS pin-multiplexing to insure a design can be partitioned across multiple FPGAs and maintain good prototype performance.

The second function of TAI Player Pro is to monitor and control a running prototype. It provides advanced features such as global clock management, hardware self-test, remote-controlled power-up sequencing, and “Virtual Switches and LEDs”, a remote I/O feature that feels like real hardware – perfect for simple tasks such as changing a setting or indicating a condition.

TAI Player Pro handles not only single board configurations (single, dual, and quad FPGAs) but multi-board configurations that can accommodate the largest of designs. Robust and battle-tested, TAI Player Pro is currently used in production by more than 200 customers.

About S2C

Founded in 2003 and headquartered in San Jose, California, S2C provides rapid SoC prototyping solutions including:

S2C’s flexible, expandable and reusable hardware architecture combined with transaction-based links to system simulations make S2C’s solution an ideal common platform for major design phases from algorithm exploration, IP design, system integration to compatibility testing. S2C currently has offices or representatives in the US, Europe, Japan, Korea, China, Taiwan, and India. For more information, visit www.s2cinc.com.

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
Apr 30, 2024
Analog IC design engineers need breakthrough technologies & chip design tools to solve modern challenges; learn more from our analog design panel at SNUG 2024.The post Why Analog Design Challenges Need Breakthrough Technologies appeared first on Chip Design....

featured video

Why Wiwynn Energy-Optimized Data Center IT Solutions Use Cadence Optimality Explorer

Sponsored by Cadence Design Systems

In the AI era, as the signal-data rate increases, the signal integrity challenges in server designs also increase. Wiwynn provides hyperscale data centers with innovative cloud IT infrastructure, bringing the best total cost of ownership (TCO), energy, and energy-itemized IT solutions from the cloud to the edge.

Learn more about how Wiwynn is developing a new methodology for PCB designs with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Package Evolution for MOSFETs and Diodes
Sponsored by Mouser Electronics and Vishay
A limiting factor for both MOSFETs and diodes is power dissipation per unit area and your choice of packaging can make a big difference in power dissipation. In this episode of Chalk Talk, Amelia Dalton and Brian Zachrel from Vishay investigate how package evolution has led to new advancements in diodes and MOSFETs including minimizing package resistance, increasing power density, and more! They also explore the benefits of using Vishay’s small and efficient PowerPAK® and eSMP® packages and the migration path you will need to keep in mind when using these solutions in your next design.
Jul 10, 2023
33,618 views