Fremont, CA — Jan 13, 2014 / (http://www.myprgenie.com) — i2a Technologies announced today the completion of its wafer UBM expansion, which will more than double its UBM and bumping services from its Silicon Valley — US based facility.  Previously, i2aTechnologies has offered both solder and Au bumping. However, because of a recent surge in demand for wafer UBM for Cu wire bonding as well as solder micro-bumping for flip chip, i2a Technologies has converted Au bumping to support UBM for Cu wire-bond, as well as solder bumping and WLCSP.

“Both i2a’s process and technology allow us to bump anything from a single die (chip) to 12 in wafers or substrates,” said Victor Batinovich, CEO at i2a Technologies. “As flip chip interconnects and WLCSP continue to gain momentum, several wafer bumping processes have been developed to produce the small solder spheres required for this technology. These processes vary significantly in complexities and costs. In general, some of these methods have limitations regarding extendibility to 12 in wafers, smaller bump sizes, pitches, as well as solder alloy flexibility. The development of our technology was driven by the need to reduce wafer bumping costs while simultaneously addressing reliability the conflicting requirements of increasing wafer dimensions, decreasing bump and pitch dimensions and alloy options.”

UBM is plated (Ni/Au or Ni /Pd /Au for solder bump and Cu wire bonding) and solder bumps are added using other methods like printing solder paste or solder ball drop. The redeeming qualities of plating include reliability, small pitches and excellent yield. However, for plating solder, plating process is inherently inflexible.  Solder paste bumping employs i2a developed proprietary process which allows us to use any alloy, achieving consistent sphere planarity ( over large substrates / wafers ) as well as minimizing sphere voiding.

For more information contact us at www.ipac.com.