industry news
Subscribe Now

Ricoh Selects Cadence Palladium XP Platform for Next-Generation Multifunction Printer SoC Development

SAN JOSE, CA–(Marketwired – July 15, 2013) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that Ricoh Corporation selected the Cadence® Palladium® XP verification computing platform for its multifunction printer system-on-chip (SoC) development, after an extensive competitive benchmarking process. Achieving the fastest design “bring-up” compared to alternative solutions, the Palladium XP platform with Cadence PCIe 2.0 Accelerated Verification IP (VIP) also delivered a 40X verification speed-up over RTL logic simulation.

“We chose the Palladium XP platform based on its superior technology, better value over alternative solutions and excellent technical support team,” said Mr. Koichi Kamon, deputy division director of the Work Solutions Development Division at Ricoh. “The simulation acceleration bring-up time with the Palladium XP platform is by far the fastest and easiest in the industry, making it an easy choice for the SoC development of our state-of-the-art multifunction printer products.”Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that Ricoh Corporation selected the Cadence® Palladium® XP verification computing platform for its multifunction printer system-on-chip (SoC) development, after an extensive competitive benchmarking process. Achieving the fastest design “bring-up” compared to alternative solutions, the Palladium XP platform with Cadence PCIe 2.0 Accelerated Verification IP (VIP) also delivered a 40X verification speed-up over RTL logic simulation.

“Ricoh is an important new Palladium XP customer for Cadence, and we are collaborating with its design team on the development and verification of their next-generation SoC,” said Nimish Modi, senior vice president, System and Software Realization Group at Cadence. “As the leader in system verification, Cadence is providing innovative solutions such as the simulation acceleration hot-swap technology between Palladium XP and Incisive® Enterprise Simulator tools as part of an integrated flow for users needing higher performance and productivity.”

Part of the Cadence System Development Suite, the Palladium XP platform is the industry’s first high-performance, special-purpose verification computing platform that unifies best-in-class simulation acceleration and emulation capabilities in a single environment. With its hot-swap technology, the Palladium XP platform delivers unparalleled productivity as users can transition among simulation, simulation acceleration, and emulation environments at runtime without re-compilation. The Palladium XP platform offers systems and semiconductor companies flexible new use models that accelerate verification and hardware-software integration, helping to assure on-time delivery of high-quality products to the market.

About Cadence

Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Littelfuse Protection IC (eFuse)
If you are working on an industrial, consumer, or telecom design, protection ICs can offer a variety of valuable benefits including reverse current protection, over temperature protection, short circuit protection, and a whole lot more. In this episode of Chalk Talk, Amelia Dalton and Pete Pytlik from Littelfuse explore the key features of protection ICs, how protection ICs compare to conventional discrete component solutions, and how you can take advantage of Littelfuse protection ICs in your next design.
May 8, 2023
41,889 views