EEJournal

industry news
Subscribe Now
May 22, 2013

TI introduces new sensorless, brushless DC motor driver to spin motors instantly

DALLAS, May 22, 2013 /PRNewswire/ — Texas Instruments Incorporated (TI) (NASDAQ: TXN) today expanded its sensorless, brushless DC (BLDC)  motor driver portfolio with a new device designed for high efficiency and low noise, which requires a low external component count of only one capacitor. The DRV10963 is a 5-V, 3-phase sensorless BLDC motor driver that simplifies layout and reduces board space by 80 percent, allowing designers to create smaller, sleeker, more innovative designs. It includes integrated commutation logic, which enables instant motor spin with no code development, while its 180-degree pure sinusoidal outputs provide an efficient and quiet drive. For more information or to place an order, visit www.ti.com/drv10963-pr.

Key features and benefits of the DRV10963:

  • Extended battery life:  Low operating range of 5.5 to 2.1 V, low RDSON of less than 1.5 ohm and ultra-low sleep currents extend battery life up to 25 percent compared to nearest competition in fans and portable, battery-powered personal health care and grooming devices, including electric razors and toothbrushes. It provides the lowest quiescent current to further extend battery life – 15 uA compared to 30 uA for the closest competitor.
  • Low power: Utilizes a 16-bit, ultra-low power MSP430G2452 Value Line microcontroller with built-in timers, up to 16 I/O touch-sense enabled pins, built-in communication and a versatile analog comparator, allowing wake-up from low-power mode to active mode in less than 1 µs.
  • Accelerated time to market: Integrated commutation logic eliminates code development, while advanced on-chip protection reduces design complexity and improves system reliability. This cutts development time from months to minutes.
  • Reduced board space and ease of use: Single-chip solution slashes board space by 80 percent compared other discrete solutions, and integrated power MOSFETs simplify layout.
  • Efficient and quiet drive: Pure sinusoidal outputs provide efficiency and noise-free operation.  

Tools and support

The DRV10963EVM evaluation module (EVM) is a cost-effective, sensorless solution for running a 3-phase BLDC motor. The EVM includes a TLC555 low-power timer configured to supply pulse width modulation (PWM), and a potentiometer to adjust the speed of the motor.

Support is available on the Motor Driver Forum in the TI E2ETM Community, where engineers can ask questions and get answers from TI experts.

Package, availability and pricing 

The DRV10963 is available now in a thermally efficient, 10-pin 3×3 mm USON package with an exposed thermal pad for a suggested retail price of US$0.49 in 1,000 unit quantities.

Learn more about TI’s motor control solutions by visiting the links below:

TI spins motors

TI combines a rich history in motor drive and control, a broad portfolio of analog and microcontroller products and a comprehensive offering of tools, software and support to deliver efficient, reliable, cost-effective motor solutions. Customers can get the right solutions at the right performance level to quickly spin any motor, including AC induction (ACIM), brushed DC, brushless DC (BLDC), PMSM and stepper.

TI analog for consumer electronics

TI’s broad range of power management and analog signal chain products offers design engineers the high performance, low power and integration they need to create innovative and differentiated consumer electronics. TI is engineering the future with gesture recognition, touch feedback, energy harvesting, wireless power, audio, health technology and more. Learn how TI analog products improve how we live, work and play at www.ti.com/analogconsumer-pr.  

About Texas Instruments

Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors.  By employing the world’s brightest minds, TI creates innovations that shape the future of technology.  TI is helping more than 100,000 customers transform the future, today.  Learn more at www.ti.com.

 

Leave a Reply

featured blogs
How Synopsys IP and TSMC’s N12e Process are Driving AIoT
May 8, 2024
Learn how artificial intelligence of things (AIoT) applications at the edge rely on TSMC's N12e manufacturing processes and specialized semiconductor IP.The post How Synopsys IP and TSMC’s N12e Process are Driving AIoT appeared first on Chip Design....
More from Synopsys...
Captivating Component Art
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
More from Max's Cool Beans...

featured video

Introducing Altera® Agilex 5 FPGAs and SoCs

Sponsored by Intel

Learn about the Altera Agilex 5 FPGA Family for tomorrow’s edge intelligent applications.

To learn more about Agilex 5 visit: Agilex™ 5 FPGA and SoC FPGA Product Overview

featured paper

Altera® FPGAs and SoCs with FPGA AI Suite and OpenVINO™ Toolkit Drive Embedded/Edge AI/Machine Learning Applications

Sponsored by Intel

Describes the emerging use cases of FPGA-based AI inference in edge and custom AI applications, and software and hardware solutions for edge FPGA AI.

Click here to read more

featured chalk talk

Package Evolution for MOSFETs and Diodes
Sponsored by Mouser Electronics and Vishay
A limiting factor for both MOSFETs and diodes is power dissipation per unit area and your choice of packaging can make a big difference in power dissipation. In this episode of Chalk Talk, Amelia Dalton and Brian Zachrel from Vishay investigate how package evolution has led to new advancements in diodes and MOSFETs including minimizing package resistance, increasing power density, and more! They also explore the benefits of using Vishay’s small and efficient PowerPAK® and eSMP® packages and the migration path you will need to keep in mind when using these solutions in your next design.
Click here for more information about Vishay Semiconductors Signal DFN Package
Jul 10, 2023
34,907 views