industry news
Subscribe Now

TI introduces industry’s first complete high-speed data converter system evaluation kit

DALLAS (March 13, 2013) – Texas Instruments Incorporated (TI) (NASDAQ: TXN) introduced the industry’s first complete high-speed data converter system evaluation kit (HSDC-SEK), which significantly reduces system evaluation costs and enables designers to get their system running in minutes. The HSDC-SEK-10 includes a pattern capture card, pattern generator card, low-jitter clock source, clean 10-MHz signal source and a multi-output regulated power supply. For more information and to purchase the kit, visit www.ti.com/hsdc-sek-10-pr.

The HSCD-SEK-10 can significantly reduce evaluation time and costs for a host of demanding applications in which high-speed data converters, such as the dual, 14-bit, 250-MSPS ADS4249 analog-to-digital converter (ADC) and the quad, 16-bit, 1.5-GSPS DAC34SH84 digital-to-analog converter (DAC), are key system performance drivers. Examples include test and measurement, communications, defense and medical equipment.

Key features and benefits of the HSDC-SEK-10

  • Significantly reduces evaluation costs: Evaluating ADCs and DACs is expensive, with lab equipment costs running as high as $20,000 or more. The low-cost HSDC-SEK-10 eliminates this investment for basic evaluation.
  • Enables quick evaluation: Systems can be up and running in as little as 30 minutes.
  • Provides complete solution for powering, clocking and evaluating data. Key system components include the following:
    • TSW4806EVM, which features the LMK04806 dual-PLL clock jitter cleaner and generator. It provides a complete, low-cost, low-noise and portable clocking solution.
    • TSW1405EVM pattern capture card, which supports most LVDS-format TI ADC evaluation modules EVMs) with a capture buffer of 64K samples.
    • TSW1406EVM pattern generator card, which supports pattern generation for most LVDS-format TI DAC EVMs, with a pattern size of up to 64K samples.
    • TSW2200EVM, which supplies low-noise power to EVMs, and the TSW2110EVM, which provides a clean 10-MHz analog input for the ADC.
  • Fast FFT analysis or pattern generation: High-Speed Data Converter Pro graphical user interface (GUI) enables speedy FFT analysis or pattern generation capabilities.

Availability and pricing

The HSDC-SEK-10 can be purchased today for US$799.

Learn more about TI’s high-speed data converter portfolio by visiting the links below:

About Texas Instruments

Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors.  By employing the world’s brightest minds, TI creates innovations that shape the future of technology.  TI is helping more than 100,000 customers transform the future, today.  Learn more at www.ti.com.

Leave a Reply

featured blogs
May 8, 2024
Learn how artificial intelligence of things (AIoT) applications at the edge rely on TSMC's N12e manufacturing processes and specialized semiconductor IP.The post How Synopsys IP and TSMC’s N12e Process are Driving AIoT appeared first on Chip Design....
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Achieve Greater Design Flexibility and Reduce Costs with Chiplets

Sponsored by Keysight

Chiplets are a new way to build a system-on-chips (SoCs) to improve yields and reduce costs. It partitions the chip into discrete elements and connects them with a standardized interface, enabling designers to meet performance, efficiency, power, size, and cost challenges in the 5 / 6G, artificial intelligence (AI), and virtual reality (VR) era. This white paper will discuss the shift to chiplet adoption and Keysight EDA's implementation of the communication standard (UCIe) into the Keysight Advanced Design System (ADS).

Dive into the technical details – download now.

featured chalk talk

Addressing the Challenges of Low-Latency, High-Performance Wi-Fi
In this episode of Chalk Talk, Amelia Dalton, Andrew Hart from Infineon, and Andy Ross from Laird Connectivity examine the benefits of Wi-Fi 6 and 6E, why IIoT designs are perfectly suited for Wi-Fi 6 and 6E, and how Wi-Fi 6 and 6E will bring Wi-Fi connectivity to a broad range of new applications.
Nov 17, 2023
23,253 views