industry news
Subscribe Now

Xilinx and TEKTELIC Reduce Cellular Radio Infrastructure Development Time with Scalable IP and High Performance Transceiver

SAN JOSE, Calif. Feb. 21, 2013 – Xilinx Inc., (NASDAQ: XLNX) today announced the availability of a high performance development solution for designing next-generation heterogeneous wireless networks, such as high-end picocells, microcells, macrocells, and active antenna arrays. Wireless system designers using TEKTELIC’s high performance, high dynamic range, wideband transceiver with Xilinx’s scalable radio IP cores greatly increase design team productivity to help customers move a generation ahead.

The availability of the Xilinx® scalable digital front end (DFE) IP cores covering Digital Up and Down (DUC/DDC) Conversion, Crest Factor Reduction (CFR) and Digital Pre-Distortion (DPD) operating on a standard Xilinx FMC evaluation board connected to TEKTELIC’s wideband radio transceiver allows equipment designers to evaluate Xilinx’s radio IP with their power amplifier equipment, or prototype and develop their own IP on Xilinx devices. TEKTELIC’s transceiver provides a high performance RF and mixed signal transmitter and an observation receiver that supports all cellular air interface standards, including the challenging Multi-Carrier GSM standard.

 “The combination of the DFE IP and transceiver enables customers to rapidly develop solutions for emerging heterogeneous wireless networks where requirements differ based on whether the system is a picocell, microcell, macrocell or active antenna array,” said David Hawke, director of wireless product marketing at Xilinx. “The IP can uniquely scale to meet these requirements to offer low cost, low power and high performance in 28nm silicon, while offering a significant time-to-market advantage through reduced development times.”

With a large number of base stations being developed worldwide, coupled with multiple air interface standards, and many geographic frequencies, OEMs are looking for ways to lower costs, increase flexibility, leverage scalability and get to market quickly. The TEKTELIC high performance wideband transceiver supports Class 1 MC-GSM up to 60 MHz transmission bandwidth, allowing customers to rapidly prototype these high performance multi-mode systems.

“Increasing RF performance and bandwidth are key to future radio system design, but it is a significant challenge to achieve the high performance demanded by MC-GSM over such wide bandwidths demanded by present Multi-RAT systems. MC-GSM in particular requires dynamic range exceeding those of 3G and 4G systems,” said David Tholl, CTO at TEKTELIC. “TEKTELIC’s new wideband transceiver has achieved class leading performance to enable rapid development of these high performance systems in conjunction with Xilinx boards and IP.”

Availability

Visit the TEKTELIC website for technical detail and purchase information for the Radio Development Board. To learn more about the Xilinx Radio IP visit http://www.xilinx.com/esp/wireless/refdes_listing.htm

About TEKTELIC Communications

TEKTELIC Communications develops leading edge small cell wireless Base Stations, wireless Backhaul Systems, high power Radios and Power Amplifiers that address 3G and 4G Service Provider coverage and rapidly growing data requirements. TEKTELIC’S innovative products include very compact form factor Base Stations, wireless Backhaul Systems, high power and high efficiency Remote Radio Heads (RRHs), Shelf Mount Radios (SMR), and Power Amplifiers. TEKTELIC products are differentiated by high quality, and compact size making them easy to deploy and simple to maintain.

About Xilinx

Xilinx is the world’s leading provider of All Programmable FPGAs, SoCs and 3D ICs. These industry-leading devices are coupled with a next-generation design environment and IP to serve a broad range of customer needs, from programmable logic to programmable systems integration. For more information, visit www.xilinx.com.

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Intel AI Update
Sponsored by Mouser Electronics and Intel
In this episode of Chalk Talk, Amelia Dalton and Peter Tea from Intel explore how Intel is making AI implementation easier than ever before. They examine the typical workflows involved in artificial intelligence designs, the benefits that Intel’s scalable Xeon processor brings to AI projects, and how you can take advantage of the Intel AI ecosystem to further innovation in your next design.
Oct 6, 2023
25,911 views