SAN JOSE, CA – January 7, 2013 – ADLINK Technology, Inc., a leading provider of embedded products and application-ready intelligent solutions, today announced the introduction of the LEC-3517, our initial ARM-based Smart Mobility Architecture (SMARC) form factor computer-on-module (COM).
The ADLINK LEC-3517 is built on a TI AM3517 System on Chip (SoC), using an ARM Cortex-A8 processor at 600 MHz and with a power envelope of less than 2 Watts. With an extraordinary performance-to-power ratio, the LEC-3517 enables system architects to use a fully passive cooled system design, ideal for portable and stationary embedded devices, such as industrial handhelds, control terminals, Human Machine Interfaces, medical devices, and industrial tablets.
ADLINK’s LEC-3517 utilizes the short version of the SMARC module definition (82 mm x 50 mm) and offers 256 MB DRAM, 512 MB NAND flash on-board. The module supports 18/24-bit Parallel LCD displays and 8-bit camera input. The LEC-3517 also features a USB 2.0 host port and a USB client port, four Serial ports, a CAN bus port, and one 10/100 Ethernet port, as well as 12 GPIO signals. Off-module storage can be implemented through either SDIO or eMMC on the carrier. Standard operating systems include Linux, Android, and Windows CE, with corresponding board support package (BSP).
Along with the release of the SMARC module, ADLINK also introduces our SMARC carrier board, LEC-BASE. The LEC-BASE functions as a reference design for the LEC product line, and also as a setup for software development and hardware testing. The LEC-BASE offers myriad I/O in addition to the basic I/O function of the CPU modules. It provides combined HDMI/DP output, RGB 18/24 bit, LVDS 18/24 bit, a touchscreen controller, GPS and G sensors, 1x GbE, HD Audio, SPDIF, CSI-2 camera input, RGB camera input, SD/SDIO, eMMC/SD/SDIO, GPIO, 4x UART, 4x USB, 1x USB OTG, 2x CAN, 1x PCI Express 1x (PCIe), and one SATA interface. Two mini PCIe sockets enable use of Wi-Fi / Bluetooth and 3G modules for connectivity. The BSP for each CPU module is configured to support the entire on-board functionality to minimize delays in testing and maximize time for application development.
The LEC-3517, as intended with the SMARC standard, can be seen as a building block to allow for effective development and a future upgrade path with coming generations of SMARC COMs. To meet the demands of industrial-grade applications, the LEC-3517 uses the robust and vibration-resistant 314 pin MXM connector, and is available with extended operating temperatures from -40OC to +85OC.
The SMARC standard is a versatile, small form factor, computer module standard jointly developed by ADLINK and other leading embedded companies. The SMARC standard is a vendor-independent standard that is held by the SGET (Standardization Group for Embedded Technologies) and was officially ratified in March 2013. The SMARC Design Guide V1.0 was finalized in August and is available for download from the SGET SMARC website: http://www.sget.org/standards/smarc.html.
For more information on the LEC-3517 and LEC-BASE, please visit www.adlinktech.com.
About SGET
The Standardization Group for Embedded Technologies, or SGET, is a technical and scientific association with its registered office in Munich. The purpose of the Association is the promotion of science and research, which is realized when—in a team effort in various workgroups on embedded computer technologies—SGET prepares and compiles technical specifications or other work results, such as implementation guidelines, software interfaces, or system requirements. These works promote energy efficiency, environmental protection, effective technology, and the application thereof for the benefit of the general public.
About ADLINK Technology
ADLINK Technology provides a wide range of embedded computing products and services to the test & measurement, automation & process control, gaming, communications, medical, network security, and transportation industries. ADLINK products include PCI Express-based data acquisition and I/O; vision and motion control; and AdvancedTCA, CompactPCI, and computer-on-modules (COMs) for industrial computing. With the acquisition of Ampro Computers, Inc. and LiPPERT Embedded Computers GmbH, ADLINK also provides a wide range of rugged by design Extreme Rugged™ and rugged product lines including single board computers, COMs and systems.
ADLINK strives to minimize the total cost of ownership (TCO) of its customers by providing customization and system integration services, maintaining low manufacturing costs, and extending the lifecycle of its products. ADLINK is a global company with headquarters and manufacturing in Taiwan; R&D and integration in Taiwan, China, the US, and Germany; and an extensive network of worldwide sales and support offices.
ADLINK is ISO-9001, ISO-14001, ISO-13485 and TL9000 certified, is an Associate Member of the Intel® Intelligent Systems Alliance, an Executive Member of PICMG, a Sponsor Member of the PXI Systems Alliance, an Executive Member of the PC/104 Consortium, an initial member of SGeT (Standardization Group for Embedded Technologies), a Strategic Member of the AXIe Consortium, and a member of VMEbus International Trade Association (VITA). ADLINK is a publicly traded company listed on the TAIEX Taiwan Stock Exchange (stock code: 6166).
