industry news
Subscribe Now

Cadence Highlights Customer Solutions at ARM TechCon 2012

SAN JOSE, CA–(Marketwire – October 25, 2012) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, will demonstrate Cadence technologies and solutions for ARM-based designs throughout the three-day ARM TechCon 2012 conference.

Cadence and ARM have collaborated on the design and verification of high-performance SoCs and Systems using an optimized solution of tools and methodologies from Cadence with processors and physical IP from ARM. These will be featured during paper presentations and sponsored sessions during the event.Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, will demonstrate Cadence technologies and solutions for ARM-based designs throughout the three-day ARM TechCon 2012 conference.

Find out how the collaboration between Cadence and ARM is enabling customers to build revolutionary electronics products — faster and with greater confidence of first-pass success.

WHERE: 
Santa Clara Convention Center 
5001 Great America Parkway, Santa Clara, Calif.

WHEN: 
October 30 – November 1, 2012 – 8:15 a.m. to 6:15 p.m.

WHAT: 
Day 1 – October 30, 2012 
Cadence Booth #36 Demonstrations

  • RTL-to-GDSII flow for ARM Cortex-A processors
  • Embedded Cortex-M0 system verification

Sponsored Sessions – Room #204

10:30 – 11:20 
Automating the verification of SoC interconnect fabrics 
Huzaifa Dalal, Senior Product Marketing Manager – VIP, Cadence and Mirit Fromovich, Staff Solutions Engineer, Cadence

11:30 – 12:20 
Power efficient big.LITTLE™ processing: lessons learned from a 28nm multi-core Cortex-A7 low-power implementation 
Paddy Mamtora, Group Director, Cadence

1:00 – 1:50 
Designing with 14nm FinFET Technology
Lars Liebman, STSM, Distinguished Engineer, Design-Technology Co-Optimization, IBM
Vassilios Gerousis, Distinguished Engineer, Cadence

2:10 – 3:00 
Implementing Advanced Next Generation Mali T6XX GPUs with Cadence Encounter Digital Flows
Sanjiv Taneja, Vice President, Research and Development, Cadence

3:10 – 4:00 
Designing mixed-signal with ARM Cortex™-M0 
Sathishkumar Balasubramanian, Senior Technical Marketing Manager

4:10 – 5:00 
Optimizing Power Efficiency in GHz+ Quad-core ARM Cortex-A15 Processor Hardening 
Paddy Mamtora, Group Director, Cadence and Ashutosh Majumdar, ARM

Technical Papers

Days 2 and 3: System and Software Design Conference – October 31 and November 1, 2012

Cadence Booth #417 Demonstrations

  • Cadence System Development Suite
  • Power-Aware Signal Integrity Analysis

Sponsored Session – Room #212; Wednesday, October 31, 11:30am – 12:30pm

Prototyping and Early Software Development for ARM-Based Embedded Systems

This session will show available prototyping options and how each can benefit hardware and software teams. Discover the benefits of using a set of connected engines that enable hardware/software co-development and verification, from virtual prototyping through RTL simulation, acceleration, and emulation to FPGA-based prototyping. Also see a detailed analysis of hybrid use models that combine RTL executed in emulation with transaction-level models running in virtual prototyping, connected through transactors, built from Accelerated Verification IP (AVIP).

Technical Papers

For a complete description of Cadence activities at ARM TechCon 2012, visit the Cadence Web site.

About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com

 

 

 

 

 

 

 

 

 

 

 

 

 

 


Leave a Reply

featured blogs
May 6, 2026
Hollywood has struck gold with The Lord of the Rings and Dune'”so which sci-fi and fantasy books should filmmakers tackle next?...

featured paper

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

Click to read more

featured chalk talk

Designing Scalable IoT Mesh Networks with Digi XBee® for Wi-SUN
Sponsored by Mouser Electronics and Digi and Silicon Labs
In this episode of Chalk Talk, Quinn Jones from Digi, Chad Steider from Silicon Labs and Amelia Dalton explore how Wi-SUN Micro-Mesh can reduce cost and simplify deployment for your next IoT mesh network. They also investigate the benefits that Digi XBee solutions bring to these types of networks and how you can jump start your next IoT mesh network design with Silicon Labs and Digi.
May 4, 2026
12,757 views