industry news
Subscribe Now

Ramtron and Module Technology Form Partnership to Extend Fast Write, Higher Density Memory to Standard RFID Readers

COLORADO SPRINGS, CO and SHENZHEN, P.R.CHINA— July 17, 2012 — U.S. semiconductor maker Ramtron International Corporation (Nasdaq: RMTR), a leading developer and supplier of low energy semiconductor products and Shenzhen, China-based Module Technology Co. Ltd., a leading supplier of UHF Radio Frequency Identification (RFID) products, today announced that they have entered into a technology partnership. Under the partnership, Ramtron and Module Technology will enhance Module Technology’s standard RFID reader hardware to support the faster and higher memory array of the Ramtron MaxArias wireless memory. The partnership will impact a wide range of customers—from smart metering, industrial manufacturing, high-value asset tracking and other data-intensive logging applications that can benefit from low power, fast write wireless memory solutions.

“Ramtron is a world-recognized leader in nonvolatile F-RAM memory,” said Mr. Wan Dunben, Module Technology’s CTO. “We believe their advanced RFID technology will enable our mutual customers to reduce their manufacturing costs and improve production throughput. 

“Modular Technology is a trailblazer in the RF space – enabling users to quickly and passively write critical data to Ramtron-enabled transponders,” said Scott Emley, Ramtron’s vice president of worldwide marketing. “We are pleased to partner with Module Technology in order to extend the benefits of our high density, fast write, and secure RF-enabled memory to a broad range of industries in the Asia-Pacific region.”

About Ramtron MaxArias wireless memory

Based on third-generation automatic identification semiconductor technology, Ramtron’s MaxArias Wireless Memory Solutions enable high-volume, data-rich asset and information tracking systems for a variety of industries and applications including utility smart metering, aircraft/industrial manufacturing, inventory control, maintenance history tracking, pharmaceutical and medical equipment tracking, building security, and product authentication. Unlike mainstream RFID tags that offer only a few kilobits of memory and exhibit inherently low performance, Ramtron’s MaxArias Wireless Memory offers expanded memory, fast data storage and retrieval enabled by proven, high-performance, nonvolatile F-RAM memory technology. MaxArias devices are also gamma radiation stable and immune to magnetic fields. Ramtron’s current MaxArias Wireless Memory Solutions conform to EPCglobal Class-1 Generation-2 UHF air interface protocol.

About Module Technology

Module Technology Co., Ltd. is an established ultra-high frequency (UHF) RFID reader manufacturer for nearly 10 years. The company consists of research and development, production and sales of RFID products that have been successfully implemented in warehousing, logistics, production management, personnel management, vehicle management, manufacturing, financial supervision, and other markets. For more information about Module Technology, visit www.moduletech.com.cn

About Ramtron

Ramtron International Corporation, headquartered in Colorado Springs, Colorado, is a fabless semiconductor company that designs, develops and markets semiconductor memory and integrated IC solutions. Ramtron pioneered the integration of ferroelectric materials into semiconductor products that enabled a class of low energy nonvolatile memory, called ferroelectric random access memory, or F-RAM. Ramtron has sold hundreds of millions of F-RAM devices into demanding applications such as automotive safety and entertainment systems, portable medical devices, industrial process control systems, smart electricity meters, and consumer printer cartridges. As the most power-efficient of any nonvolatile memory technology on the market, F-RAM products promise to pave the way for the development of ultra-efficient battery powered products and energy harvesting applications, among others. For more information, visitwww.ramtron.com or email framinfo@ramtron.com.

Leave a Reply

featured blogs
May 6, 2026
Hollywood has struck gold with The Lord of the Rings and Dune'”so which sci-fi and fantasy books should filmmakers tackle next?...

featured paper

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

Click to read more

featured chalk talk

Designing Scalable IoT Mesh Networks with Digi XBee® for Wi-SUN
Sponsored by Mouser Electronics and Digi and Silicon Labs
In this episode of Chalk Talk, Quinn Jones from Digi, Chad Steider from Silicon Labs and Amelia Dalton explore how Wi-SUN Micro-Mesh can reduce cost and simplify deployment for your next IoT mesh network. They also investigate the benefits that Digi XBee solutions bring to these types of networks and how you can jump start your next IoT mesh network design with Silicon Labs and Digi.
May 4, 2026
11,161 views