industry news
Subscribe Now

Ericsson Extends 3E Gold Design Kit with New Development Boards

  • World-Class 3E design kit helps power architects to develop the next generation of energy-efficient systems
  • 3E Gold Edition design kit enables easy implementation of Ericsson’s Advanced Bus Converters and the PMBus-compliant Point-of-Load DC-DC regulators
  • Two new development boards include support for Single-Inline-Package versions of Point-of-Load DC-DC regulators and heavily paralleled operation for high current carrying capability applications

Ericsson has announced an extension to its 3E Gold Design Kit with the launch of two new development board kits. Launched in June 2011, the 3E Gold Edition Design Kit has been widely used by board and system architects and enables the easy implementation of Ericsson’s Advanced Bus Converters – the BMR453 and BMR454 – and the company’s 3E PMBus-compliant Point-of-Load DC-DC regulators – the BMR462, BMR463 and BMR464.

Developed for system-level power design, the new ROA1285068 and ROA1285077 3E design kits enable systems architects to develop not only the exact power architecture required for their final application, but also to configure and monitor every single component to optimize performance and reduce energy consumption. The two new board kits can also be interconnected with other 3E kits such as the ROA1283835 and the ROA1283836 and can be used as stand-alone kits for smallersystems or educational purposes.

“The availability of these new design and development boards further extend the capabilities of Ericsson’s leading-edge 3E Gold Edition Design Kit,” said Patrick Le Fèvre, Marketing and Communication Director, Ericsson Power Modules. “In conjunction with the recent launch of the Ericsson Digital Power Compendium, they further demonstrate the company’s strong commitment to help engineers in developing advanced power solutions for world-class energy efficiency.”

For easy control, monitoring and programming of the target 3E Point-of-Load DC-DC converters, the two boards are PMBus compliant and can be connected via Ericsson’s KEP91017 USB-to-PMBus adaptor to a personal computer running the 3E Gold Edition software package. 

ROA1285068 Design Board – Single-In-Line 3E Point-of-Load

The ROA1285068 is dedicated to the Single-In-Line (SIP) versions of Ericsson’s 3E digital Point-of-Load convertersThe board includes eight sockets: two for the BMR462/2 (12A SIP 3E-POL); three for the BMR453/2 (20A SIP 3E-POL); and three for the BMR464/2 (40A SIP 3E-POL). In addition to the ability to control, monitor andtest single POLs, the ROA1285068 kit also allows parallel operation of up to three modules, delivering up to 120A output current, providing the capability for board power designers to optimize current sharing before application implementationthereby reducing time-to-market. 

ROA1285077 Design Board – Extensive paralleling up to 280A

The ROA1285077 has been specially designed for customers requiring the connection of up to seven modules in parallel, reaching an output current of up to 280A. The board layout has been optimized for high current and includes high-power connectors for connection to external loads; the board also includes seven sockets to accommodate either the 20A BMR463-PI or the 40A BMR464-PI. 

Digital Power Compendium

The user guide to the Ericsson 3E Gold Edition software is also available in the recently launched Digital Power Compendium, available for download at digitalpowercompendium.comwhich offers more than 450 pages on important digital power technologies including 17 technical papers and specifications on Ericsson’s advanced 3E power converters. 

Price

The ROA1285068 and ROA1285077 boards are priced at $800 each.

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
Apr 30, 2024
Analog IC design engineers need breakthrough technologies & chip design tools to solve modern challenges; learn more from our analog design panel at SNUG 2024.The post Why Analog Design Challenges Need Breakthrough Technologies appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

The Future of Intelligent Devices is Here
Sponsored by Alif Semiconductor
In this episode of Chalk Talk, Amelia Dalton and Henrik Flodell from Alif Semiconductor explore the what, where, and how of Alif’s Ensemble 32-bit microcontrollers and fusion processors. They examine the autonomous intelligent power management, high on-chip integration and isolated security subsystem aspects of these 32-bit microcontrollers and fusion processors, the role that scalability plays in this processor family, and how you can utilize them for your next embedded design.
Aug 9, 2023
31,773 views