industry news
Subscribe Now

MSC presents Qseven 1.20 Baseboard for ARM Modules

Stutensee, Germany – At SPS/IPC/DRIVES in hall 7, booth 290, MSC Vertriebs GmbH presents its new embedded platform MSC Q7-MB-EP4 ideal for fast development of embedded systems with the ARM® processor based MSC Q7-NT2 Qseven™ module. The powerful baseboard is ready-to-use for small and medium production quantities and can save the customer in-house design effort. 

The embedded platform MSC Q7-MB-EP4 has been designed to follow the latest version (1.20) of the Qseven™ specification and offers a CAN interface. It is designed for the industrial temperature range of    -40 to +85°C and is therefore the ideal platform for the MSC Q7-NT2 Qseven™ module which is also available for this temperature range. 

The new Qseven™ baseboard Q7-MB-EP4 offers a broad range of important interfaces for embedded applications like dual Gbit Ethernet, five USB 2.0 ports (four external), RS-232 (pin header), AC97 audio and SATA. The CAN signals are available via a special pin header. An ARM RS-232 Debug port for a console output simplifies Linux software development. For the integration of industry displays, the embedded platform provides LVDS via a JILI30 connector and a DVI connector. Furthermore the platform integrates a controller for the connection of a resistive touch screen and provides the power supply for a backlight.

To provide an option for added functionality of the 148 x 102mm compact motherboard, a mini PCI Express™ slot is integrated allowing the addition of e.g. a wireless LAN card. The mSATA slot provides an easy way to add a SATA based flash memory card. On top of that the baseboard can be individually configured by customers via the integrated MMC/SD card slot.

The compact MSC Q7-NT2 Qseven™ module is mounted via a proven MXM connection on the solder side of the MSC Q7-MB-EP4  baseboard, making it easy to thermally connect the Qseven™ heat spreader to a metal enclosure and provide fanless heat dissipation. Via the implemented direct digital interface (DDI) the digital video signals of the module are directly connected with the DVI connector.

The high-performance Qseven™ module MSC Q7-NT2 is based on the NVIDIA Tegra™ 290 low-power processor with dual core ARM® Cortex A9. The compact board consumes only 5 W typical. The onboard ultra low-power 3D graphics controller GeForce OpenGL ES 2.0 offers a full HD resolution and supports MPEG4/H.264 video encoding (D1) and decoding (Full HD).

Thanks to its special graphics functionality, the Qseven™ module MSC Q7-NT2 is designed particularly for visualization applications, for example, in the medical sector and for image processing tasks. Demanding digital signage, multimedia, entertainment and Internet TV systems can also be implemented with the module. Furthermore, due to the extended temperature range, the platform is also perfect for use in industrial applications in harsh environments and for transportation applications.

MSC Vertriebs GmbH

MSC Vertriebs GmbH is a European-wide service company in the field of electronic components, board-level products, and customer specific development of industrial hardware. Founded in 1982, MSC Vertriebs GmbH operates today as a pan-European distributor and manufacturer in a consolidated company with over 1600 employees. 

Products requiring intensive technical support, such as COM Express™, ETX® components, EXM 32, Qseven™ and microcontrollers & tools, programmable logic & tools, ASICs, industrial motherboards, power and linear products, displays, optoelectronics, as well as memory modules are our specialty and make MSC one of the leading companies for high-tech solutions.

MSC distinguishes itself distinctly from its competitors with its competent applications and development engineers, as well as its design capacity for hardware, ASICs, and BIOS. The regional location to its suppliers and the consistent approach toward new technologies, guarantee a high level of competency for its customers.

Leave a Reply

featured blogs
Apr 24, 2026
A thought experiment in curiosity, confusion, and cosmic consequences....

featured paper

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

Click to read more

featured chalk talk

Designing Scalable IoT Mesh Networks with Digi XBee® for Wi-SUN
Sponsored by Mouser Electronics and Digi and Silicon Labs
In this episode of Chalk Talk, Quinn Jones from Digi, Chad Steider from Silicon Labs and Amelia Dalton explore how Wi-SUN Micro-Mesh can reduce cost and simplify deployment for your next IoT mesh network. They also investigate the benefits that Digi XBee solutions bring to these types of networks and how you can jump start your next IoT mesh network design with Silicon Labs and Digi.
May 4, 2026
30 views