industry news
Subscribe Now

Dialog Semiconductor’s DA6011 Power Management IC is Ideal Companion For Intel® Atom(TM) Processor E6XX-Based Designs

Kirchheim/Teck, Germany, 30 August 2011 – Dialog Semiconductor plc (FWB: DLG), a provider of highly integrated innovative power management, audio and short range wireless technologies, has announced its companion IC for the Intel® Atom(TM) processor E6xx series, DA6011, has been adopted by Taiwan based ADLINK Technology for its mini size COM Express type 10 module, nanoX-TC. Measuring just 84×55 mm the nanoX-TC is among the smallest computer-on-modules available.

“The market for Intel® Atom(TM) processor E6xx-based devices is growing quickly with a rapid global adoption, and ADLINK’s nanoX-TC is a prime example of what can be achieved. It joins a wide range of Dialog design wins for applications in the industrial, embedded computing, media phone, green power-generation, in-vehicle infotainment and medical markets,” said Udo Kratz, vice president, general manager Audio and Power Management Business Unit at Dialog.

“The integration, flexibility and efficiency inherent in the Intel Atom processor E6xx series enables designs, such as ADLINK’s nanoX-TC, that are very small, dedicated and energy efficient,” said Jonathan Luse, marketing director of the Low Power Embedded Products Division at Intel. “Having a compatible power management IC solution for the Intel® Atom(TM) processor E6xx series, such as the Dialog DA6011, helps developers to minimise platform part count and reduce BOM cost and design complexity.”

The nanoX-TC is a rugged, robust PC module capable of enduring up to 15G peak to peak shocks and 1.88 Grms vibration. It uses the full processing capabilities of the Intel® Atom(TM) processor E6xx and consumes just 5W at 5V (3W idle), making it ideally suited to a wide range of industrial applications.

Henk van Bremen, product director at ADLINK, added: “The tiny, 4600mm2 board means we have to be as efficient as possible, both in terms of layout and power. In addition, battery size shouldn’t be the limiting factor for a computer and therefore properly managed power usage is vital. It was essential to use a single chip power management solution to further cut board space, BOM, cost and power consumption to the lowest possible levels without compromise and the DA6011 precisely regulates the heart of the nanoX-TC.”

Dialog’s DA6011 integrates both power management and clock driver functionality for the Intel® Atom(TM) processor E6xx; it is the industry’s only single chip solution and was designed as part of Dialog’s Processor Partner Programme. To maximise efficiency, the DA6011 precisely regulates power and provides the clock source to core system components: Intel Atom processor E6xx, flash memory, RAM and I/O hubs.
In addition to this, Dialog has implemented a new feature so that the DA6011’s latest version can use AT & ATX power supplies, and is able to continuously support Intel’s dynamic voltage control of the core and graphic processor.

Dialog Semiconductor will be demonstrating the DA6011 companion power management IC at the three-day Intel Developer Forum (IDF), San Francisco beginning 13th September.

Leave a Reply

featured blogs
May 8, 2024
Learn how artificial intelligence of things (AIoT) applications at the edge rely on TSMC's N12e manufacturing processes and specialized semiconductor IP.The post How Synopsys IP and TSMC’s N12e Process are Driving AIoT appeared first on Chip Design....
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...

featured video

Why Wiwynn Energy-Optimized Data Center IT Solutions Use Cadence Optimality Explorer

Sponsored by Cadence Design Systems

In the AI era, as the signal-data rate increases, the signal integrity challenges in server designs also increase. Wiwynn provides hyperscale data centers with innovative cloud IT infrastructure, bringing the best total cost of ownership (TCO), energy, and energy-itemized IT solutions from the cloud to the edge.

Learn more about how Wiwynn is developing a new methodology for PCB designs with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver.

featured paper

Altera® FPGAs and SoCs with FPGA AI Suite and OpenVINO™ Toolkit Drive Embedded/Edge AI/Machine Learning Applications

Sponsored by Intel

Describes the emerging use cases of FPGA-based AI inference in edge and custom AI applications, and software and hardware solutions for edge FPGA AI.

Click here to read more

featured chalk talk

Maximizing High Power Density and Efficiency in EV-Charging Applications
Sponsored by Mouser Electronics and Infineon
In this episode of Chalk Talk, Amelia Dalton and Daniel Dalpiaz from Infineon talk about trends in the greater electrical vehicle charging landscape, typical block diagram components, and tradeoffs between discrete devices versus power modules. They also discuss choices between IGBT’s and Silicon Carbide, the advantages of advanced packaging techniques in both power discrete and power module solutions, and how reliability is increasingly important due to demands for more charging cycles per day.
Dec 18, 2023
20,703 views