EEJournal

industry news
Subscribe Now
July 18, 2011

TI’s new development kit helps engineers quickly and easily design Bluetooth® technology-enabled applications based on Stellaris® microcontrollers

DALLAS, Texas, July 18 /PRNewswire/ — Texas Instruments Incorporated (TI) (NYSE: TXN) today announced the Stellaris® 2.4 GHz CC2560 Bluetooth® Wireless Kit (DK-EM2-2560B), aimed at jumpstarting Bluetooth®-enabled designs. The kit includes the high-throughput, power-efficient CC2560 Bluetooth solution and proven Bluetooth stack within StellarisWare® software. The performance and integration of Stellaris MCUs pair with TI’s leading Bluetooth solution to help developers address the demand for more streaming audio, remote control and data transfer in industrial and consumer applications. For complete details, visit www.ti.com/bt-kit-2560b-pr-tf. For a video demonstration, visit www.ti.com/bt-kt-pr-v.

With this offering, TI further expands its broad portfolio of complete microcontroller and wireless technology solutions, which includes 16- and 32-bit MCUs backed by ZigBee®, low-power wireless, RFID, and Bluetooth hardware and software. The Stellaris 2.4 GHz CC2560 Bluetooth Wireless Kit is modular and can be combined with the same Stellaris DK-LM3S9B96 Development Kit that serves as a baseboard for other Stellaris wireless solutions. When coupled with the DK- LM3S9B96 development board, the kit includes all hardware and software needed to jumpstart development. It also speeds the design process, as engineers are able to evaluate the working Bluetooth solution within 10 minutes or less using the included quick-start application. 

What’s included in the Stellaris 2.4 GHz CC2560 Bluetooth Wireless Kit

Software

  • StellarisWare® software, including peripheral driver library and example source code
  • Bluetopia® Bluetooth stack – developed by Stonestreet One and licensed, delivered and supported by TI – which includes the Serial Port Profile (SPP), Advanced Audio Distribution Profile (A2DP) and Audio Video Remote Control Profile (AVRCP) with sample applications

Hardware

  • Stellaris DK-LM3S9B96-EM2 Expansion Board
  • PAN1323 Bluetooth v2.1 + Enhanced Data Rate (EDR) Module
  • TI eZ430 USB emulator with Bluetooth target board and plastic cover
  • Battery board
  • Two AAA batteries
  • Earbud headphones
  • StellarisWare® CD

Features and benefits of the Stellaris 2.4 GHz CC2560 Bluetooth Wireless Kit

Features

Benefits

Bluetooth 2.1 technology + EDR support

Best-in-class Bluetooth RF performance for robust, high-throughput wireless connection, extended range and better power efficiency

Complete, validated, certified, production-ready module (PAN1323 used for evaluation, PAN1315 or PAN1325 used for production)

Lower manufacturing and operating costs, save board space, ease certification, minimize RF expertise required

Sample applications for the Stellaris LM3S9000 series, with demos showing API usage provided in source code

Simplifies and reduces hardware and software development, allowing faster time-to-market

Price and availability

The Stellaris 2.4 GHz CC2560 Bluetooth Wireless Kit (DK-EM2-2560B) is priced at $199 US, and available to order today at www.ti.com/bt-kit-2560b-pr-es. The DK-LM3S9B96 is sold separately for $425 U.S., and available to order today at www.ti.com/bt-kit-9b96-pr-es.    

Find out more about TI’s MCU and wireless connectivity solutions

Leave a Reply

featured blogs
How Synopsys IP and TSMC’s N12e Process are Driving AIoT
May 8, 2024
Learn how artificial intelligence of things (AIoT) applications at the edge rely on TSMC's N12e manufacturing processes and specialized semiconductor IP.The post How Synopsys IP and TSMC’s N12e Process are Driving AIoT appeared first on Chip Design....
More from Synopsys...
Captivating Component Art
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
More from Max's Cool Beans...

featured video

Introducing Altera® Agilex 5 FPGAs and SoCs

Sponsored by Intel

Learn about the Altera Agilex 5 FPGA Family for tomorrow’s edge intelligent applications.

To learn more about Agilex 5 visit: Agilex™ 5 FPGA and SoC FPGA Product Overview

featured paper

Altera® FPGAs and SoCs with FPGA AI Suite and OpenVINO™ Toolkit Drive Embedded/Edge AI/Machine Learning Applications

Sponsored by Intel

Describes the emerging use cases of FPGA-based AI inference in edge and custom AI applications, and software and hardware solutions for edge FPGA AI.

Click here to read more

featured chalk talk

Enabling the Evolution of E-mobility for Your Applications
Sponsored by Mouser Electronics and TE Connectivity
The next generation of electric vehicles, including trucks, buses, construction and recreational vehicles will need connectivity solutions that are modular, scalable, high performance, and can operate in harsh environments. In this episode of Chalk Talk, Amelia Dalton and Daniel Domke from TE Connectivity examine design considerations for next generation e-mobility applications and the benefits that TE Connectivity’s PowerTube HVP-HD Connector Series bring to these designs.
Click here for more information about TE Connectivity PowerTube Connectors
Feb 28, 2024
10,579 views