industry news
Subscribe Now

Carbon Releases Solution for AMBA TLM-2.0 Modeling

ACTON, MASS. –– February 17, 2011 –– Carbon Design Systems™, the leading supplier of tools for the automatic creation, validation and deployment of system-level models, today unveiled a TLM-2.0 solution for the AMBA™ protocol to enable modeling the widely adopted AMBA® protocols with SystemC TLM2-0.  

Available from Carbon’s IP Exchange at no charge, the software contains definitions and extensions for AMBA 3 AXI3™, AHB™, AHB-Lite™ and APB™ protocols at the loosely timed, approximately timed and cycle-timed levels of abstraction.  Adapters are provided to bridge between abstraction levels and to connect directly to the AMBA Programmer’s View (PV) interface used by ARM’s Fast Models. 

“Many designers encounter compatibility problems when attempting to reuse TLM-2.0 models for the AMBA protocol from other companies or even within their own company,” comments Bill Neifert, chief technology officer (CTO) at Carbon Design Systems.  “The market has needed an accessible, non-proprietary solution that provides a set of definitions for TLM-2.0 for AMBA to run in any SystemC environment.  With this solution, Carbon’s continues to deliver tools to ease the process of virtual platform model reuse for all designers using AMBA protocols, regardless of their EDA vendor.”

“Our integrations of complex System-On-Chip ICs that include the AMBA protocol and other protocols, exploit TLM based SystemC virtual platforms,” says Alain Clouard, manager of System Platforms Group, Home Entertainment and Displays, STMicroelectronics.  “We welcome protocol owners, such as ARM, teaming with partners to define SystemC representation of their protocols.  Model suppliers adopting a unique and TLM-based cycle-accurate (CA) definition of the AMBA protocol, is making it easier for IP users to integrate, where needed, various CA models for AMBA, such as ‘Carbonized’ IP models, in higher-level simulation platforms such as ST’s TLM_TAC virtual SoC.  Enabling the communication of such CA model with higher-level TLM AT or TLM LT models in this virtual SoC, is facilitated by the common base TLM standard.”

About the Package

The TLM-2.0 for the AMBA protocol solution will execute in any SystemC environment and contains no runtime licensing.  Using the source, examples and documentation provided in the kit, designers can create models representing AMBA intellectual property (IP) blocks at any level of abstraction. 

To ensure compatibility with ARM’s Fast Models, Carbon has teamed with ARM to include the PV definitions for AMBA used by the Fast Models’ TLM-2.0 interface as part of the kit.

“ARM is pleased to support efforts to create virtual models of AMBA protocol IP and have provided our PV SystemC/TLM-2.0 compliant interface to this effort to help ensure seamless interaction with our widely adopted Fast Models,” remarks Tony Smith, product manager, Fast Models at ARM.

Availability

The TLM-2.0 for the AMBA protocol solution is available for immediate download from Carbon’s IP Exchange web portal located at: www.carbonipexchange.com.  To access the tool, select “Free Downloads” from the IP Categories menu. 

About Carbon Design Systems

Carbon Design Systems connects hardware and software teams with a unified virtual platform that offers 100% accuracy for architectural analysis and performance analysis, and hundreds of MIPs performance for pre-silicon firmware and software development. Solutions are based on open industry standards, including SystemC, IP-XACT, Verilog, VHDL, OSCI TLM, MDI, SCML, CASI, CADI and CAPI.  Carbon’s customers are systems, semiconductor, and IP companies that focus on wireless, networking, and consumer electronics.  Carbon is headquartered at 125 Nagog Park, Acton, Mass., 01720.  Telephone:  (978) 264-7300.  Facsimile:  (978) 264-9990.  Email:  info@carbondesignsystems.com.  Website:  www.carbondesignsystems.com.

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
Apr 30, 2024
Analog IC design engineers need breakthrough technologies & chip design tools to solve modern challenges; learn more from our analog design panel at SNUG 2024.The post Why Analog Design Challenges Need Breakthrough Technologies appeared first on Chip Design....

featured video

Why Wiwynn Energy-Optimized Data Center IT Solutions Use Cadence Optimality Explorer

Sponsored by Cadence Design Systems

In the AI era, as the signal-data rate increases, the signal integrity challenges in server designs also increase. Wiwynn provides hyperscale data centers with innovative cloud IT infrastructure, bringing the best total cost of ownership (TCO), energy, and energy-itemized IT solutions from the cloud to the edge.

Learn more about how Wiwynn is developing a new methodology for PCB designs with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Maximizing High Power Density and Efficiency in EV-Charging Applications
Sponsored by Mouser Electronics and Infineon
In this episode of Chalk Talk, Amelia Dalton and Daniel Dalpiaz from Infineon talk about trends in the greater electrical vehicle charging landscape, typical block diagram components, and tradeoffs between discrete devices versus power modules. They also discuss choices between IGBT’s and Silicon Carbide, the advantages of advanced packaging techniques in both power discrete and power module solutions, and how reliability is increasingly important due to demands for more charging cycles per day.
Dec 18, 2023
18,957 views