industry news
Subscribe Now

Magma’s FineSim Deployed by Toshiba Corporation for Advanced Flash Memory Sign-off Simulation

SAN JOSE, Calif. and YOKOHAMA, Japan, Nov. 30, 2010 — Magma® Design Automation Inc. (Nasdaq: LAVA), a provider of chip design software, announced today that Toshiba Corporation, a leading provider of flash memory products, has deployed the FineSim™ platform for sign-off simulation. Toshiba uses FineSim Pro with the native multi-CPU technology for its NAND flash memory development.

“Toshiba’s flash products, featuring leading-edge technology and functionality, are highly differentiated and used in wide variety of applications,” said Masaki Momodomi, Memory Technology Executive of Toshiba Corporation’s Semiconductor Company. “This makes it imperative that we are first to market with highly reliable products. Magma’s unified circuit simulation platform increases our overall design productivity by allowing us to make intelligent tradeoffs between performance and accuracy within a single tool.” 

“Toshiba’s decision to use FineSim as its primary circuit simulation solution demonstrates the value of Magma’s unified multi-CPU simulation platform,” said Anirudh Devgan, general manager of Magma’s Custom Design Business Unit. “With the performance improvement provided by FineSim leading semiconductor providers such as Toshiba can reduce design and manufacturing costs while meeting critical time-to-market goals.” 

FineSim SPICE: Simulating Advanced Circuits

FineSim SPICE is a SPICE-level simulation analysis tool that incorporates transistor-level simulation analysis capabilities for mixed-digital and analog designs. In addition, FineSim SPICE supports distributed processing over multiple CPUs or machines, enabling simulation of large-scale mixed-signal designs. By providing increased speed and capacity while maintaining full-SPICE accuracy, FineSim SPICE enables designers to simulate advanced circuits – such as PLLs, ADCs (analog-to-digital converters), DACs (digital-to-analog converters) and gigahertz SERDES (SERializers/DESerializers) – that they previously would not even attempt using slower traditional SPICE simulators. 

FineSim Pro: First to Offer Multi-CPU Support

FineSim Pro is the industry’s first fast SPICE circuit simulator that supports multi-CPU simulations. It is the only simulator that performs true multi-CPU SPICE analysis. This allows for the most accurate results with the best possible throughput. FineSim Pro verifies a range of designs from large memories to large complex analog ICs, which previously could not be practically verified in transient circuit simulators. FineSim Pro also has a separate option for IR drop and electromigration analysis. 

About Magma

Magma’s electronic design automation (EDA) software provides the “Fastest Path to Silicon”™ and enables the world’s top chip companies to create high-performance integrated circuits (ICs) for smart phones, cellular telephones, electronic games, WiFi, MP3 players, digital video, networking and other electronic applications. Magma products are used in IC implementation, analog/mixed-signal design, analysis, physical verification, circuit simulation and characterization. The company maintains headquarters in San Jose, Calif., and offices throughout North America, Europe, Japan, Asia and India. Magma’s stock trades on Nasdaq under the ticker symbol LAVA. Follow Magma on Twitter at www.Twitter.com/MagmaEDA and on Facebook at www.Facebook.com/Magma. Visit Magma Design Automation on the Web at www.magma-da.com and www.magma-da.co.jp.

Leave a Reply

featured blogs
Apr 2, 2026
Build, code, and explore with your own AI-powered Mars rover kit, inspired by NASA's Perseverance mission....

featured paper

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

Click to read more

featured chalk talk

Connecting the World Through Space
Sponsored by Mouser Electronics and Qorvo
In this episode of Chalk Talk, Ryan Jennings from Qorvo and Amelia Dalton explore the critical components and design challenges inherent in LEO satellite infrastructure and how Qorvo’s solutions are enabling the next generation of space-based connectivity. 
Mar 30, 2026
22,782 views