Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.
In this episode of Chalk Talk, Paul Fadlovich from TE Connectivity and Martin Lesund from Nordic Semiconductor and Amelia Dalton explore the what, why and how of NTN technology. They also explore the role that antennas play in satellite communication systems, and how Nordic Semiconductor’s nRF9151 System-in-Package and TE Connectivity’s broad range of antenna solutions can jump start your next global IoT design.