fresh bytes
Subscribe Now

The first 3D-printed steel bridge looks like it broke off an alien mothership

The plan to 3D-print a bridge in mid-air was always bonkers. How could a technology best known for creating flimsy prototypes and personalized action figures be used for permanent construction projects? Well, the team at MX3D in Amsterdam just answered all of the hard questions and revealed it: the world’s first 3D-printed bridge. It’s made of a completely new type of steel, spans 40 feet, and will be installed early next year in De Wallen, the largest and best-known red-light district in Amsterdam. It also looks utterly otherworldly. Read more at Gizmodo.

Leave a Reply

featured blogs
Dec 1, 2023
Why is Design for Testability (DFT) crucial for VLSI (Very Large Scale Integration) design? Keeping testability in mind when developing a chip makes it simpler to find structural flaws in the chip and make necessary design corrections before the product is shipped to users. T...
Nov 27, 2023
See how we're harnessing generative AI throughout our suite of EDA tools with Synopsys.AI Copilot, the world's first GenAI capability for chip design.The post Meet Synopsys.ai Copilot, Industry's First GenAI Capability for Chip Design appeared first on Chip Design....
Nov 6, 2023
Suffice it to say that everyone and everything in these images was shot in-camera underwater, and that the results truly are haunting....

featured video

Dramatically Improve PPA and Productivity with Generative AI

Sponsored by Cadence Design Systems

Discover how you can quickly optimize flows for many blocks concurrently and use that knowledge for your next design. The Cadence Cerebrus Intelligent Chip Explorer is a revolutionary, AI-driven, automated approach to chip design flow optimization. Block engineers specify the design goals, and generative AI features within Cadence Cerebrus Explorer will intelligently optimize the design to meet the power, performance, and area (PPA) goals in a completely automated way.

Click here for more information

featured paper

Power and Performance Analysis of FIR Filters and FFTs on Intel Agilex® 7 FPGAs

Sponsored by Intel

Learn about the Future of Intel Programmable Solutions Group at intel.com/leap. The power and performance efficiency of digital signal processing (DSP) workloads play a significant role in the evolution of modern-day technology. Compare benchmarks of finite impulse response (FIR) filters and fast Fourier transform (FFT) designs on Intel Agilex® 7 FPGAs to publicly available results from AMD’s Versal* FPGAs and artificial intelligence engines.

Read more

featured chalk talk

Enabling IoT with DECT NR+, the Non-Cellular 5G Standard
In the ever-expanding IoT market, there is a growing need for private, low cost networks. In this episode of Chalk Talk, Amelia Dalton and Heidi Sollie from Nordic Semiconductor explore the details of DECT NR+, the world’s first non-cellular 5G technology standard. They investigate how this self-healing, decentralized, autonomous mesh network can help solve a variety of IoT connectivity issues and how Nordic is helping designers take advantage of DECT NR+ with their nRF91 System-in-Package family.
Aug 17, 2023
13,456 views