Hayden Taylor, assistant professor of mechanical engineering at the University of California, Berkeley, and senior author of a paper on the technology explained that the printer relies on a viscous liquid that reacts to form a solid when exposed to a certain threshold of light. Projecting carefully crafted patterns of light – essentially “movies” – onto a rotating cylinder of liquid solidifies the desired shape “all at once.” [Source]
 New package technology improves EMI and thermal performance with smaller solution sizeSponsored by Texas Instruments Power supply designers have a new tool in their effort to achieve balance between efficiency, size, and thermal performance with DC/DC power modules. The Enhanced HotRod™ QFN package technology from Texas Instruments enables engineers to address design challenges with an easy-to-use footprint that resembles a standard QFN. This new package type combines the advantages of flip-chip-on-lead with the improved thermal performance presented by a large thermal die attach pad (DAP). Click here to download the whitepaper |
