fresh bytes
Subscribe Now

How Dungeons and Dragons can change your life (with Daniel Carter)

This week we take a curious peek into the world of Dungeons & Dragons. If you love D&D you’ll relate and learn. If you have never played D&D (and have little-to-no interest) you will be delighted and amazed.

What can fantasy, roll playing games teach us about life and business strategy?

More here (via Applied Curiosity Lab)

 

Leave a Reply

featured blogs
Dec 1, 2021
We discuss semiconductor lithography and the importance of women in engineering with Mariya Braylovska, Director of R&D for Custom Design & Manufacturing. The post Q&A with Mariya Braylovska, R&D Director, on the Joy of Solving Technical Challenges with a...
Dec 1, 2021
'Virtuoso Meets Maxwell' 是ä¸ç³»åˆ—æ—¨å¨æŽ¢è®¨Virtuoso RF 和 Virtuoso MultiTech现æ‰åŠæ½å¨åŠŸèƒ½çš„博客ã‚Virtuoso又是如何与麦克斯韦方程组(Maxwell)联系上çš...
Nov 30, 2021
Have you ever wondered why Bill is a common nickname for William and Dick is a common nickname for Richard?...
Nov 8, 2021
Intel® FPGA Technology Day (IFTD) is a free four-day event that will be hosted virtually across the globe in North America, China, Japan, EMEA, and Asia Pacific from December 6-9, 2021. The theme of IFTD 2021 is 'Accelerating a Smart and Connected World.' This virtual event ...

featured video

Achronix VectorPath Accelerator Card Uses PCIe Gen4 x16 to Communicate with AMD Ryzen PC

Sponsored by Achronix

In this demonstration, the Achronix VectorPath™ accelerator card connects to an AMD Ryzen based PC using PCIe Gen4 x16 interface. The host PC issues commands to have the Speedster™7t FPGA on the VectorPath accelerator card write and read to external GDDR6 memory on the board. These data transactions are performed using the Speedster7t FPGA’s 2D network on chip or NoC which eliminates the need to write complex RTL code to design the host PC to GDDR6 memory interface.

Contact Achronix for a Demonstration of Speedster7t FPGA

featured paper

3D-IC Design Challenges and Requirements

Sponsored by Cadence Design Systems

3D-ICs are expected to have a broad impact on networking, graphics, AI/ML, and high-performance computing. While there’s interest in 3D-ICs, it’s still in its early phases. Standard definitions are lacking, the supply chain ecosystem is in flux, and design, analysis, verification, and test challenges need to be resolved. Read this white paper to learn about 3D integration and packaging of multiple stacked dies, design challenges, ecosystem requirements, and needed solutions.

Click here to read more

featured chalk talk

Build, Deploy and Manage Your FPGA-based IoT Edge Applications

Sponsored by Mouser Electronics and Intel

Designing cloud-connected applications with FPGAs can be a daunting engineering challenge. But, new platforms promise to simplify the process and make cloud-connected IoT design easier than ever. In this episode of Chalk Talk, Amelia Dalton chats with Tak Ikushima of Intel about how a collaboration between Microsoft and Intel is pushing innovation forward with a new FPGA Cloud Connectivity Kit.

Click here for more information about Terasic Technologies FPGA Cloud Connectivity Kit