fresh bytes
Subscribe Now

Google’s new modular phone may be the last you’ll need to buy

ara-01-660x495.jpg

At the Project Ara Developer’s Conference in Santa Clara, California, the moment of unveiling was a bit of a letdown. When project lead Paul Eremenko got ready for the big reveal — finally showing off Google’s vision for a modular phone with working, user-interchangeable components — he had to dampen expectations from the enthusiastic crowd. “You should temper your applause,” he warned, explaining that the device had been damaged the previous day. “We did crack the screen, and the phone doesn’t quite boot.” A disappointment, sure, but it did little to actually temper anything.

Project Ara is Google’s attempt to reinvent the cellphone as we know it. Instead of a slab of glass and metal that you have no ability to upgrade, save for buying a new device, it’s an attempt to launch a phone where all of the main components are interchangeable via modules that click in and out, attaching via electro-permanent magnets. Despite being highly customizable, it will only come in three main sizes, helping to eliminate the kind of device fragmentation that currently plagues Android. Google plans to roll out a “gray model,” a very basic device that costs as little as $50, as well as higher-end handsets that could go for as much as $500 and up. The former will be released first — around this time next year if all goes according to plan — and will likely be a smaller, Wi-Fi-only version. This bare-bones model will be followed by the higher-end ones eventually. But Google’s initial objective is to ramp up a hardware ecosystem that moves at the same pace as the software it runs.
via Wired

Continue reading 

Photo: Norman Chan/Tested.com

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Altera® FPGAs and SoCs with FPGA AI Suite and OpenVINO™ Toolkit Drive Embedded/Edge AI/Machine Learning Applications

Sponsored by Intel

Describes the emerging use cases of FPGA-based AI inference in edge and custom AI applications, and software and hardware solutions for edge FPGA AI.

Click here to read more

featured chalk talk

Portable Medical Devices and Connected Health
Decentralized healthcare is moving from hospitals and doctors’ offices to the patients’ home and office and in the form of personal, wearable, and connected devices. In this episode of Chalk Talk, Amelia Dalton and Roger Bohannan from Littelfuse examine the components, functions and standards for a variety of portable connected medical devices. They investigate how Littelfuse can help you navigate the development of your next portable connected medical design.
Jun 26, 2023
35,025 views