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Axolotl genome sequenced, revealing regeneration genes

If you lose an arm or a leg, there’s a whole range of advanced prosthetics to give you some functionality back. But we might not need any artificial help in the long run if research into limb regeneration bears fruit. Scientists have now sequenced the genome of the Mexican axolotl, and have identified a few key genes hidden amongst its extremely complex genetic blueprint. Continue reading at New Atlas

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featured blogs
Nov 30, 2021
Explore the history of the chip design process, from the days of Integrated Device Manufacturers (IDMs) to EDA tools and today's era of democratized design. The post Just What Is Democratized Design Anyway? appeared first on From Silicon To Software....
Nov 30, 2021
The demand for smaller electronics devices can be achieved by high-density layers in multi-layer build-up substrates or multi-layered printed circuit boards (PCB). Vias are essential in the design... [[ Click on the title to access the full blog on the Cadence Community site...
Nov 29, 2021
Tell me if you've heard this before, but I'm looking for a Nordic word that has a sufficiently amorphous gestalt to make it confusing to explain in Norwegian....
Nov 8, 2021
Intel® FPGA Technology Day (IFTD) is a free four-day event that will be hosted virtually across the globe in North America, China, Japan, EMEA, and Asia Pacific from December 6-9, 2021. The theme of IFTD 2021 is 'Accelerating a Smart and Connected World.' This virtual event ...

featured video

Integrity 3D-IC: Industry’s First Fully Integrated 3D-IC Platform

Sponsored by Cadence Design Systems

3D stacking of ICs is emerging as a preferred solution for chip designers facing a slowdown in Moore’s Law and the rising costs of advanced nodes. However, chip stacking creates new complexities, with extra considerations required for the mechanical, electrical, and thermal aspects of the whole stacked system. Watch this video for an overview of Cadence® Integrity™ 3D-IC, a comprehensive platform for 3D planning, implementation, and system analysis, enabling system-driven PPA for multi-chiplet designs.

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featured paper

3D-IC Design Challenges and Requirements

Sponsored by Cadence Design Systems

3D-ICs are expected to have a broad impact on networking, graphics, AI/ML, and high-performance computing. While there’s interest in 3D-ICs, it’s still in its early phases. Standard definitions are lacking, the supply chain ecosystem is in flux, and design, analysis, verification, and test challenges need to be resolved. Read this white paper to learn about 3D integration and packaging of multiple stacked dies, design challenges, ecosystem requirements, and needed solutions.

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featured chalk talk

High-Performance Test to 70 GHz

Sponsored by Samtec

Today’s high-speed serial interfaces with PAM4 present serious challenges when it comes to test. Eval boards can end up huge, and signal integrity of the test point system is always a concern. In this episode of Chalk Talk, Amelia Dalton chats with Matthew Burns of Samtec about the Bullseye test point system, which can maintain signal integrity up to 70 GHz with a compact test point footprint.

Click here for more information about Samtec’s Bulls Eye® Test System