Jumping Jack Flash Memory

3D Flash and Beyond

by Amelia Dalton

In this week’s Fish Fry, we’re exploring everyone’s favorite non-volatile memory technology: flash. (And not just any old kind of flash!) Scott Nelson from Toshiba gives us the scoop on a new 3D flash memory technology. We discuss the advantages of 3D flash memory and look at how 3D flash memory will change how we use memory technology in the future. Keeping with our 3D theme, we also check out a new 3D printing technique developed at Northwestern University that aims to make metallic 3D printing cheaper, faster, and more robust than ever before.

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Links for January 15, 2016

More information about Toshiba’s 3D Flash Memory

Metallic Architectures from 3D-Printed Powder-Based Liquid Inks (Research Paper)

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

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featured chalk talk

Connecting the World Through Space

Sponsored by Mouser Electronics and Qorvo

In this episode of Chalk Talk, Ryan Jennings from Qorvo and Amelia Dalton explore the critical components and design challenges inherent in LEO satellite infrastructure and how Qorvo’s solutions are enabling the next generation of space-based connectivity.

Click here for more information about Qorvo SATCOM 13.75GHz to 14.5GHz GaN Power Amplifiers

Mar 30, 2026

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Jumping Jack Flash Memory

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