fish fry
Subscribe Now

MEMS and Candy

Air Signatures, Death Star Candies, and Other Things We Love

In honor of Valentine’s Day next week, Fish Fry is all about love. From our love of sugary Death Star-shaped treats to our love of MEMS-enabled devices. This week my guest is Bryan Hoadley (President – Movea). Bryan and I get into to the nitty gritty details of the Movea Lab and Bryan gives me a special demonstration of their air signature technology. We’re also delving into the world of specialized Valentine’s Day treats this week, and pick our favorite gift for that special geeky someone in your life. 

I’m giving everyone the chance to win a LaunchPad Evaluation kit courtesy of Texas Instruments, but you’ll have to listen to find out how to enter to win.

Listen to this episode
Download this episode (right click and save)

Fish Fry Links – February 8, 2012

Designer Lollipop Etsy Site – Death Star Lollipops

More Information about Movea

New Chalk Talk – “Maximinizing Battery Life With TI’s Wolverine Technology”

New Chalk Talk – Verification Methodologies (Made Easy)

More Information about the MSP430 LaunchPad Evaluation Kit

More Information about TI’s MCU BoosterPack Design Challenge

Fish Fry Executive Interviews

Moshe Gavrielov, CEO – Xilinx

Darrin Billerbeck, CEO – Lattice Semiconductor

Lauro Rizzatti, Vice President of Marketing, EVE

Bill Neifert, CTO – Carbon Design Systems

Sean Dart, CEO – Forte Design Systems

Kapil Shankar, CEO – SiliconBlue

Andy Pease, CEO – QuickLogic

Rajeev Madhavan, CEO – Magma 

Paul Kocher, President – Cryptography Research Inc.

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Jeff Waters, VP and General Manager – Altera

Luc Burgun, CEO and President, EVE 

Leave a Reply

featured blogs
Nov 30, 2021
Explore the history of the chip design process, from the days of Integrated Device Manufacturers (IDMs) to EDA tools and today's era of democratized design. The post Just What Is Democratized Design Anyway? appeared first on From Silicon To Software....
Nov 30, 2021
The demand for smaller electronics devices can be achieved by high-density layers in multi-layer build-up substrates or multi-layered printed circuit boards (PCB). Vias are essential in the design... [[ Click on the title to access the full blog on the Cadence Community site...
Nov 29, 2021
Tell me if you've heard this before, but I'm looking for a Nordic word that has a sufficiently amorphous gestalt to make it confusing to explain in Norwegian....
Nov 8, 2021
Intel® FPGA Technology Day (IFTD) is a free four-day event that will be hosted virtually across the globe in North America, China, Japan, EMEA, and Asia Pacific from December 6-9, 2021. The theme of IFTD 2021 is 'Accelerating a Smart and Connected World.' This virtual event ...

featured video

Integrity 3D-IC: Industry’s First Fully Integrated 3D-IC Platform

Sponsored by Cadence Design Systems

3D stacking of ICs is emerging as a preferred solution for chip designers facing a slowdown in Moore’s Law and the rising costs of advanced nodes. However, chip stacking creates new complexities, with extra considerations required for the mechanical, electrical, and thermal aspects of the whole stacked system. Watch this video for an overview of Cadence® Integrity™ 3D-IC, a comprehensive platform for 3D planning, implementation, and system analysis, enabling system-driven PPA for multi-chiplet designs.

Click here for more information

featured paper

Add Authentication Security to Automotive Endpoints Using the 1-Wire Interface

Sponsored by Maxim Integrated (now part of Analog Devices)

By adding a single authentication IC, automotive designers can authenticate a component with only one signal between an ECU and endpoint component. This is particularly important as counterfeit and theft are increasingly problems in automotive applications. This application note describes how to implement the DS28E40 Deep Cover 1-Wire Authenticator in a system to provide authentication for optical cameras, headlamps, EV Batteries, occupancy sensors, and even steering wheels, and more.

Click to read more

featured chalk talk

KISSLING Products: Rugged and Reliable Solutions

Sponsored by Mouser Electronics and TE Connectivity

Rugged and reliable designs today have a specific set of design requirements that may not be found in other industries including robustness, durability, and the ability to resist harsh environments. In this episode of Chalk Talk, Amelia Dalton chats with Mark Dickson from TE Connectivity about the KISSLING product family which includes a wide variety of rugged and reliable solutions for your next design.

Click here for more information about TE Connectivity / KISSLING Ruggedized Switching Products