EEJournal

fish fry
Subscribe Now
September 28, 2012

It’s All in the Timing (Closure)

by Amelia Dalton

How many of you have gotten lost in your own corporate office building? Maybe it was your first week on the job? As hard as it is for us to navigate our own buildings, can you imagine what it’s like for emergency responders? In this week’s Fish Fry we check out a new real-time 3D mapping prototype being developed by MIT and examine how it could revolutionize the way we navigate the world around us. Also this week, I interview Steve Yang (President and Founder – ICScape). Steve and I chat about how ICScape can help your timing closure problems, what their tool suite looks like, and what’s ahead for this new EDA startup from China. 

Listen to this episode
Download this episode (right click and save)

Fish Fry Links – September 28, 2012

MIT News – Automatic building mapping could help emergency responders

More Information about ICScape

 

Leave a Reply

featured blogs
Just What Is Democratized Design Anyway?
Nov 30, 2021
Explore the history of the chip design process, from the days of Integrated Device Manufacturers (IDMs) to EDA tools and today's era of democratized design. The post Just What Is Democratized Design Anyway? appeared first on From Silicon To Software....
More from Synopsys...
IC Packagers: Creating and Using Non-rounded Via Stacks in Package Designs
Nov 30, 2021
The demand for smaller electronics devices can be achieved by high-density layers in multi-layer build-up substrates or multi-layered printed circuit boards (PCB). Vias are essential in the design... [[ Click on the title to access the full blog on the Cadence Community site...
More from Cadence...
Groping for Le Mot Juste
Nov 29, 2021
Tell me if you've heard this before, but I'm looking for a Nordic word that has a sufficiently amorphous gestalt to make it confusing to explain in Norwegian....
More from Max's Cool Beans...
We Hope to See You at Intel® FPGA Technology Day 2021
Nov 8, 2021
Intel® FPGA Technology Day (IFTD) is a free four-day event that will be hosted virtually across the globe in North America, China, Japan, EMEA, and Asia Pacific from December 6-9, 2021. The theme of IFTD 2021 is 'Accelerating a Smart and Connected World.' This virtual event ...
More from Intel...

featured video

Integrity 3D-IC: Industry’s First Fully Integrated 3D-IC Platform

Sponsored by Cadence Design Systems

3D stacking of ICs is emerging as a preferred solution for chip designers facing a slowdown in Moore’s Law and the rising costs of advanced nodes. However, chip stacking creates new complexities, with extra considerations required for the mechanical, electrical, and thermal aspects of the whole stacked system. Watch this video for an overview of Cadence® Integrity™ 3D-IC, a comprehensive platform for 3D planning, implementation, and system analysis, enabling system-driven PPA for multi-chiplet designs.

Click here for more information

featured paper

Enhancing PSAP Audio Performance and Power Efficiency in Hearables with Anti-Noise

Sponsored by Maxim Integrated (now part of Analog Devices)

Personal sound amplification products (PSAP) enhance user’s listening experiences with hearables in challenging environments. Long delay in the audio system creates distortion known as comb effect in PSAP. This paper investigates the root cause of the comb effect and explains how Maxim’s PSAP based on anti-noise solution yields a superior system performance than conventional PSAP solutions.

Click to read more

featured chalk talk

Benefits and Applications of Immersion Cooling

Sponsored by Samtec

For truly high-performance systems, liquid immersion cooling is often the best solution. But, jumping into immersion cooling requires careful consideration of elements such as connectors. In this episode of Chalk Talk, Amelia Dalton chats with Brian Niehoff of Samtec about connector solutions for immersion-cooled applications.

Click here for more information about Samtec immersion cooling solutions