fish fry
Subscribe Now

Processing The Future

In this week’s Fish Fry, we investigate the recent formation of the Heterogeneous System Architecture (HSA) foundation and check out how it may or may not save us from a bunch of processor-related hassle in the future. Speaking of processors, I interview John Heinlein, Ph.D (ARM) about the newest developments with the big.LITTLE architecture, processor optimization packs, and how refreshing old nodes can be easier than you expect.

Also this week, I’m giving away an XMEGA-A3BU Xplained kit (courtesy of Atmel) but you’ll have to tune in to find out how to win.

Fish Fry Links – June 15, 2012

More Information about The HSA Foundation

Recent News about ARM’s Processor Optimization Packs 

More Information about ARM’s Processor Optimization Packs

More Information about ARM’s Design Start Online Portal

More Information about ARM’s big.LITTLE Processing

More Information about the XMEGA-A3BU Xplained Kit (Courtesy of Atmel)

Fish Fry Executive Interviews

Moshe Gavrielov, CEO – Xilinx

John Bruggeman, Former CMO – Cadence Design Systems

Darrin Billerbeck, CEO – Lattice Semiconductor

Lauro Rizzatti, Vice President of Marketing, EVE

Bill Neifert, CTO – Carbon Design Systems

Sean Dart, CEO – Forte Design Systems

Kapil Shankar, CEO – SiliconBlue

Andy Pease, CEO – QuickLogic

Rajeev Madhavan, CEO – Magma 

Paul Kocher, President – Cryptography Research Inc.

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Leave a Reply

featured blogs
Mar 28, 2024
'Move fast and break things,' a motto coined by Mark Zuckerberg, captures the ethos of Silicon Valley where creative disruption remakes the world through the invention of new technologies. From social media to autonomous cars, to generative AI, the disruptions have reverberat...
Mar 26, 2024
Learn how GPU acceleration impacts digital chip design implementation, expanding beyond chip simulation to fulfill compute demands of the RTL-to-GDSII process.The post Can GPUs Accelerate Digital Design Implementation? appeared first on Chip Design....
Mar 21, 2024
The awesome thing about these machines is that you are limited only by your imagination, and I've got a GREAT imagination....

featured video

We are Altera. We are for the innovators.

Sponsored by Intel

Today we embark on an exciting journey as we transition to Altera, an Intel Company. In a world of endless opportunities and challenges, we are here to provide the flexibility needed by our ecosystem of customers and partners to pioneer and accelerate innovation. As we leap into the future, we are committed to providing easy-to-design and deploy leadership programmable solutions to innovators to unlock extraordinary possibilities for everyone on the planet.

To learn more about Altera visit: http://intel.com/altera

featured chalk talk

Package Evolution for MOSFETs and Diodes
Sponsored by Mouser Electronics and Vishay
A limiting factor for both MOSFETs and diodes is power dissipation per unit area and your choice of packaging can make a big difference in power dissipation. In this episode of Chalk Talk, Amelia Dalton and Brian Zachrel from Vishay investigate how package evolution has led to new advancements in diodes and MOSFETs including minimizing package resistance, increasing power density, and more! They also explore the benefits of using Vishay’s small and efficient PowerPAK® and eSMP® packages and the migration path you will need to keep in mind when using these solutions in your next design.
Jul 10, 2023
29,545 views