fish fry
Subscribe Now

Wirelessly Going Where No Man Has Gone Before

Africa, Atmel and the MEMS in Between

This week’s Fish Fry is all about wireless technology and how it is shaping the world today. First up, I interview Martin Squibbs from Atmel about a big announcement in the world of RF transceivers. Martin talks to me about a technology that may change the roadmap for battery-operated wireless applications in the industrial and consumer market places. Next up, I check out how wireless technology is shaping medical care in Africa, and finally I’ve got a short Interview with Karen Lightman about the MEMS Industry Group and how they are looking to carve out new avenues for future MEMS applications.

Also this week, I have a MACHXO Pico Development Kit courtesy of Lattice Semiconductor to give away, but you’ll have to listen to find out how to win.

Fish Fry Links – April 20, 2012

Atmel 2.4GHz Low-Power RF Transceiver Redefines Lowest Power Consumption for Industrial Applications

More Information about Atmel

M2M technology is preventing HIV infection in thousands of African children

More Information about Telit Wireless Solutions

More Information about The MEMS Industry Group

More Information about the MachXO2 Pico Development Kit

Fish Fry Executive Interviews

Moshe Gavrielov, CEO – Xilinx

John Bruggeman, Former CMO – Cadence Design Systems

Darrin Billerbeck, CEO – Lattice Semiconductor

Lauro Rizzatti, Vice President of Marketing, EVE

Bill Neifert, CTO – Carbon Design Systems

Sean Dart, CEO – Forte Design Systems

Kapil Shankar, CEO – SiliconBlue

Andy Pease, CEO – QuickLogic

Rajeev Madhavan, CEO – Magma 

Paul Kocher, President – Cryptography Research Inc.

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Leave a Reply

featured blogs
May 24, 2022
By Melika Roshandell Today's modern electronic designs require ever more functionality and performance to meet consumer demand. These requirements make scaling traditional, flat, 2D-ICs very... ...
May 24, 2022
Nicholas Temese, who hails from Quebec, Canada, creates highly detailed handcrafted miniature scale models of classic computers from yesteryear....
May 24, 2022
By Neel Natekar Radio frequency (RF) circuitry is an essential component of many of the critical applications we now rely… ...
May 19, 2022
Learn about the AI chip design breakthroughs and case studies discussed at SNUG Silicon Valley 2022, including autonomous PPA optimization using DSO.ai. The post Key Highlights from SNUG 2022: AI Is Fast Forwarding Chip Design appeared first on From Silicon To Software....

featured video

EdgeQ Creates Big Connections with a Small Chip

Sponsored by Cadence Design Systems

Find out how EdgeQ delivered the world’s first 5G base station on a chip using Cadence’s logic simulation, digital implementation, timing and power signoff, synthesis, and physical verification signoff tools.

Click here for more information

featured paper

Reduce EV cost and improve drive range by integrating powertrain systems

Sponsored by Texas Instruments

When you can create automotive applications that do more with fewer parts, you’ll reduce both weight and cost and improve reliability. That’s the idea behind integrating electric vehicle (EV) and hybrid electric vehicle (HEV) designs.

Click to read more

featured chalk talk

Faster, More Predictable Path to Multi-Chiplet Design Closure

Sponsored by Cadence Design Systems

The challenges for 3D IC design are greater than standard chip design - but they are not insurmountable. In this episode of Chalk Talk, Amelia Dalton chats with Vinay Patwardhan from Cadence Design Systems about the variety of challenges faced by 3D IC designers today and how Cadence’s integrated, high-capacity Integrity 3D IC Platform, with its 3D design planning and implementation cockpit, flow manager and co-design capabilities will not only help you with your next 3D IC design.

Click here for more information about Integrity 3D-IC Platform from Cadence Design Systems