fish fry
Subscribe Now

Intelligence in the Ether: Cloud Computing, Robot Internet and The Future of AI

Fish Fry - February 18, 2011

In my Fish Fry this week, I throw down the gauntlet against Watson the IBM Jeopardy competitor and explore the role of artificial intelligence in the world of electronic engineering.  I also investigate a new Internet for robots, FPGA design tools in the Cloud and why the Internet as we know it may be in peril. Also this week, I reveal last week’s nerdy giveaway winner and announce another even more fabulous nerdy giveaway for this week.

If you like the idea of this new series, be sure to drop a comment in the box below. I appreciate all of your comments so far, and we will be working to enhance the Fish Fry each week – as long as you’re watching.

 

Watch Previous Fish Frys

Fish Fry Links – February 18, 2011

Turing Test

Machine Learning

Running Out of IP Addresses

Leave a Reply

featured blogs
Oct 21, 2020
We'€™re concluding the Online Training Deep Dive blog series, which has been taking the top 15 Online Training courses among students and professors and breaking them down into their different... [[ Click on the title to access the full blog on the Cadence Community site. ...
Oct 20, 2020
In 2020, mobile traffic has skyrocketed everywhere as our planet battles a pandemic. Samtec.com saw nearly double the mobile traffic in the first two quarters than it normally sees. While these levels have dropped off from their peaks in the spring, they have not returned to ...
Oct 19, 2020
Have you ever wondered if there may another world hidden behind the facade of the one we know and love? If so, would you like to go there for a visit?...
Oct 16, 2020
[From the last episode: We put together many of the ideas we'€™ve been describing to show the basics of how in-memory compute works.] I'€™m going to take a sec for some commentary before we continue with the last few steps of in-memory compute. The whole point of this web...

Featured Paper

Four Ways to Improve Verification Performance and Throughput

Sponsored by Cadence Design Systems

Learn how to address your growing verification needs. Hear how Cadence Xcelium™ Logic Simulation improves your design’s performance and throughput: improving single-core engine performance, leveraging multi-core simulation, new features, and machine learning-optimized regression technology for up to 5X faster regressions.

Click here for more information about Xcelium Logic Simulation

featured Paper

New package technology improves EMI and thermal performance with smaller solution size

Sponsored by Texas Instruments

Power supply designers have a new tool in their effort to achieve balance between efficiency, size, and thermal performance with DC/DC power modules. The Enhanced HotRod™ QFN package technology from Texas Instruments enables engineers to address design challenges with an easy-to-use footprint that resembles a standard QFN. This new package type combines the advantages of flip-chip-on-lead with the improved thermal performance presented by a large thermal die attach pad (DAP).

Click here to download the whitepaper

Featured Chalk Talk

A New Perspective on Materialism

Sponsored by Mouser Electronics and KEMET

When choosing capacitors or other passive components, it’s easy to get bogged down in the datasheets. But, how often do you think about the properties of the materials these components are made from? In this episode of Chalk Talk, Amelia Dalton and Patrik Kalbermatten of KEMET take a fascinating look at material classification, the role of ferrite in systems, and the development of metal composite piezo ceramic powders to give us sustainable sources for our component materials.

Click here for more information about KEMET Electronics Sensor Components