FPGA Packaging and Signal Integrity
High-speed system interconnects have a large impact on integrated circuit (IC) package design. High-speed connectivity requires fabrication of packages that are able to support very fast varying, broadband signals with good signal integrity (SI). Based on Moore’s law, on-chip clock frequency doubles every 18 months and the intrinsic delay of the gate decreases exponentially to a few picoseconds (ps). Increasing I/O counts add another element to this equation. Rent’s rule states that the number of I/O will double in the next ten years, which means that there will be a lot … Read More → "FPGA Packaging and Signal Integrity"

