VIA Announces VIA AMOS-5000 Chassis Kit for Fanless Em-ITX Embedded Systems
Rugged, versatile and fanless, the VIA AMOS-5000 modular chassis kit leverages dual I/O coastlines for I/O intensive industrial PCs
Taipei, Taiwan, November 4, 2009 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA AMOS-5000, a specially designed chassis kit for Em-ITX form factor boards such as the VIA EITX-3000, offering fast and easy assembly of a variety of fanless, robust IPC designs.
Built using only five sections the VIA AMOS-5000 has the VIA-developed Em-ITX at its heart, offering developers a wealth of advantages including rich and versatile I/O … Read More → "VIA Announces VIA AMOS-5000 Chassis Kit for Fanless Em-ITX Embedded Systems"

