— New Feature Expands MOSFET Options for Hot Swap Designs —

HILLSBORO, OR — NOVEMBER 9, 2009 — Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the addition of two new higher performance devices to its second generation Power Manager II product family. Both the ispPAC®-POWR1014-2 and ispPAC-POWR1014A-2 devices integrate higher voltage charge pumps with programmable current to control MOSFETs in Hot Swap and Sequencing applications. These new devices are pin compatible with existing Power Manager II devices, and integrate power management functions that typically require multiple ICs, including Hot Swap Controllers, Reset Generators, Voltage Supervisors, Sequencers … Read More → "Lattice Announces Improved Hot Swap Support For Power Management Devices"

Halstenbek, Germany – November 6th, 2009 – TEWS TECHNOLOGIES extends its tradition of delivering high-density I/O solutions with the introduction of a synchronous/asynchronous serial single width / mid-height AMC.1 compliant module with four high speed communication channels. The TAMC863 is designed for data communications, LAN/WAN networking, military communications, traffic control, simulation, and telecommunications applications.

The serial communication controller is implemented in FPGA logic, combined with the bus master capable PCI interface. The FGPA design guarantees long term availability with the option to implement additional application specific functions for customers.

Several serial communication protocols … Read More → "TEWS TECHNOLOGIES Introduces FPGA-Based 4 Channel High Speed Synch/Asynch Serial Interface"

Halstenbek, Germany – November 6th, 2009 – TEWS TECHNOLOGIES extends its tradition of delivering high-density I/O solutions with the introduction of a synchronous/asynchronous serial single width / mid-height AMC.1 compliant module with four high speed communication channels. The TAMC863 is designed for data communications, LAN/WAN networking, military communications, traffic control, simulation, and telecommunications applications.

The serial communication controller is implemented in FPGA logic, combined with the bus master capable PCI interface. The FGPA design guarantees long term availability with the option to implement additional application specific functions for customers.

Several serial communication protocols … Read More → "TEWS TECHNOLOGIES Introduces FPGA-Based 4 Channel High Speed Synch/Asynch Serial Interface"

MOUNTAIN VIEW, Calif., Nov. 5, 2009 – Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that Realtek Semiconductor Corp, a leading provider of advanced IC products for communications network, computer peripheral and multimedia applications, has signed an expanded business agreement establishing Synopsys as its primary EDA partner. Under the new multi-year agreement, Realtek has extended its use of Synopsys’ Galaxy(tm) Implementation, Discovery(tm) Verification and Confirma(tm) Rapid Prototyping Platforms, as well as Synopsys’ DesignWare(r) IP and consulting services.

“By selecting Synopsys as … Read More → "Synopsys chosen by Realtek as its primary EDA partner"

Redesign based on customer feedback includes new customization features

Thief River Falls, Minnesota (USA) — November 5, 2009 — Electronic components distributor Digi-Key Corporation, recognized by design engineers as having the industry’s broadest selection of electronic components available for immediate shipment, today announced the launching of a newly redesigned version of its toolbar.

Redesigned with busy design engineers, purchasers, and electronic enthusiasts in mind, the new version of Digi-Key’s Toolbar allows for additional customization. Features include quick access to each of Digi-Key’s 25 country-specific websites and eight language options, giving the user the ability … Read More → "Digi-Key Corporation Launches Digi-Key Toolbar Version 2"

Redesign based on customer feedback includes new customization features

Thief River Falls, Minnesota (USA) — November 5, 2009 — Electronic components distributor Digi-Key Corporation, recognized by design engineers as having the industry’s broadest selection of electronic components available for immediate shipment, today announced the launching of a newly redesigned version of its toolbar.

Redesigned with busy design engineers, purchasers, and electronic enthusiasts in mind, the new version of Digi-Key’s Toolbar allows for additional customization. Features include quick access to each of Digi-Key’s 25 country-specific websites and eight language options, giving the user the ability … Read More → "Digi-Key Corporation Launches Digi-Key Toolbar Version 2"

XP Power announced today the HPU1K5 1500 Watt AC/DC power supply series aimed at a broad range of industrial applications that require bulk power within a compact enclosure. Three single output models are available covering the nominal output voltages of +12, +24, or + 48 VDC, with each being user adjustable either manually, or via an external voltage signal. The universal input range covers 85-264 VAC, with output power up to 1500 Watts available at high line input and up to 1200 Watts when using input voltages below 180 VAC. Using an integral fan, the supply can be mounted either vertically or horizontally and … Read More → "Low profile 1500 Watt AC/DC power supply suits industrial bulk power applications"

NEUBIBERG, Germany and HSINCHU, Taiwan, R.O.C., Nov. 5 /PRNewswire-FirstCall/ — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Taiwan Semiconductor Manufacturing Company (TWSE: 2330, NYSE: TSM) today announced that they are extending their development and production partnership to a 65nanometer (nm) embedded flash (eFlash) process technology targeting next generation automotive, chip card and security applications. Based on the agreement, Infineon and TSMC will jointly develop 65nm process technologies for eFlash microcontrollers (MCUs) that fulfill the stringent quality requirements of the automotive industry, as well as the demanding security requirements of the chip card and security markets.

The … Read More → "Infineon and TSMC Extend Technology And Production Partnership Agreement; Will Jointly Develop 65nm Embedded Flash Process Technology For Automotive and Chip Card Applications"

More FPGA resources and higher clock rate bring better performance to imaging applications

November 3, 2009, Stuttgart, Germany — At Vision 2009, Matrox Imaging is pleased to announce the Matrox Radient eCL Camera Link® frame grabber now supports the Altera® Stratix® IV processing FPGAs.

“With its 820K logic elements (LEs) the Stratix® IV brings the processing capabilities of the Matrox Radient eCL to a new level,” explains Pierantonio Boriero, Product Line Manager, Matrox Imaging. “More processing elements enable a greater amount of processing parallelism. When greater parallelism is coupled with … Read More → "Matrox Radient eCL high-performance Camera Link® frame grabber now supports Altera® Stratix® IV processing FPGA"

Highly Integrated 8-bit MCUs Significantly Reduce System Cost in Automotive Electronics

AUSTIN, Texas–(BUSINESS WIRE)–Silicon Laboratories Inc. (NASDAQ: SLAB), a leader in high-performance, analog-intensive, mixed-signal ICs, today announced a new line of highly C8051F5xx automotive-qualified microcontrollers (MCUs) that enable a dramatic reduction in system cost and footprint in body electronics applications. The highly integrated C8051F5xx family eliminates the need for discrete analog components and offers industry-leading throughput, reducing code size and further lowering system cost. The new pin- and software-compatible 8-bit devices are ideal for cost-sensitive, space-constrained embedded body control applications, … Read More → "Silicon Labs Expands Family of Automotive-Qualified Microcontrollers"