EEJournal

feature article
Subscribe Now
September 21, 2018

EE Journal’s Live Coverage of World Maker Faire 2018

by Larra Morris

Our EE Journal Team went to World Maker Faire 2018!

World Maker Faire New York returned for it’s 9th year at the New York Hall of Science and we were there to cover all the invention, creativity, curiosity and hands-on learning the Faire had to offer.

This year’s World Maker Faire will featured more than 800 projects and multiple stages focused on making for social good, health, food and technology, as well as the latest developments in microelectronics, 3D printing, food, drones, robotics, and more. 

We’ve collected all our tweets covering the 2018 Faire so that you can catch up on our coverage:

 

Leave a Reply

featured blogs
Wireless Communication Transforms Industrial Frontline
Sep 21, 2023
Wireless communication in workplace wearables protects and boosts the occupational safety and productivity of industrial workers and front-line teams....
More from Silicon Labs...
Learn How Labforge Is Bringing AI into Vision Systems
Sep 21, 2023
Labforge is a Waterloo, Ontario-based company that designs, builds, and manufactures smart cameras used in industrial automation and defense applications. By bringing artificial intelligence (AI) into their vision systems with Cadence , they can automate tasks that are diffic...
More from Cadence...
Embodied AI: How do AI-powered robots perceive the world? [+video]
Sep 21, 2023
At Qualcomm AI Research, we are working on applications of generative modelling to embodied AI and robotics, in order to enable more capabilities in robotics....
More from Qualcomm OnQ Blog...
Known Unknowns
Sep 21, 2023
Not knowing all the stuff I don't know didn't come easy. I've had to read a lot of books to get where I am....
More from Max's Cool Beans...
Samsung Foundry and Synopsys Accelerate Multi-Die System Design
Sep 21, 2023
See how we're accelerating the multi-die system chip design flow with partner Samsung Foundry, making it easier to meet PPA and time-to-market goals.The post Samsung Foundry and Synopsys Accelerate Multi-Die System Design appeared first on Chip Design....
More from Synopsys...

Featured Video

Chiplet Architecture Accelerates Delivery of Industry-Leading Intel® FPGA Features and Capabilities

Sponsored by Intel

With each generation, packing millions of transistors onto shrinking dies gets more challenging. But we are continuing to change the game with advanced, targeted FPGAs for your needs. In this video, you’ll discover how Intel®’s chiplet-based approach to FPGAs delivers the latest capabilities faster than ever. Find out how we deliver on the promise of Moore’s law and push the boundaries with future innovations such as pathfinding options for chip-to-chip optical communication, exploring new ways to deliver better AI, and adopting UCIe standards in our next-generation FPGAs.

To learn more about chiplet architecture in Intel FPGA devices visit https://intel.ly/45B65Ij

featured paper

An Automated Method for Adding Resiliency to Mission-Critical SoC Designs

Sponsored by Synopsys

Adding safety measures to SoC designs in the form of radiation-hardened elements or redundancy is essential in making mission-critical applications in the A&D, cloud, automotive, robotics, medical, and IoT industries more resilient against random hardware failures that occur. This paper discusses the automated process of implementing the safety mechanisms/measures (SM) in the design to make them more resilient and analyze their effectiveness from design inception to the final product.

Click here to read more

featured chalk talk

Johnson RF Connectivity Solutions
Sponsored by Mouser Electronics and Cinch Connectivity
The growing need for remote patient monitoring and wireless connectivity has made RF in medicine applications more important than ever before. In this episode of Chalk Talk, Amelia Dalton chats with Ketan Thakkar from Cinch Connectivity Solutions about the growing trends in medicine today that are encouraging the use of RF, why higher frequency, smaller form factor, cable assembly expansion and adapter expansion are vital components in today’s medical applications and why Johnson medical solutions could be a great fit for your next medical design.
Click here for more information about Johnson / Cinch Connectivity Solutions SMA Connectors
Nov 28, 2022
34,937 views