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Most adavanced ADC module with built-in processig resource is launched

RENO, NEVADA – 18th May 2010 – Sundance Digital Signal Processing Inc., a leading provider of high performance signal processing and reconfigurable multiprocessor systems today introduced the DSP464 as the latest addition to its family of high performance ADC/DAC hardware solutions. Designed for use in PMC/ XMC form factors, the DSP464 delivers multiprocessor capture and processing capabilities for single unit installation or cascade deployment in heterogeneous networks. Optimized for wideband, low noise, signal processing applications the DSP464’s PCIe, PCI-X and Serial RapidIO interfaces allow the transfer of high bandwidth data to host systems.

The DSP464 continues Sundance DSP’s convention of easy access to interoperable, modular signal processing design. It can be used across an array of carriers and platforms including VME, cPCI and Advanced TCA (ATCA) to deliver the highest levels of design performance and operational flexibility. Application design is supported by PARS (Parallel Application from Rapid Simulation) that enables designers to generate system target code, including DSP codes, FPGA codes and all of the inter- processor communication and synchronization codes from a Simulink model.

“The speed, accuracy and feature rich specification of DSP464 makes it a compelling solution for applications where the continuous acquisition of analogue signals and distribution of digital data to PCI and multi-gigabit interfaces are critical”, said Nory Nakhaee, CEO of Sundance DSP Inc. “With the DSP464 being supported by the PARS design environment, engineers can rapidly develop their system in Matlab/ Simulink and do not need to rely upon pre-defined 3rd party IP for FPGA design tasks.”

To support high frequency digitization and wide dynamic range, Sundance DSP selected four channels of Linear Technology’s 130Msps, sampling 16-bit high-resolution multi-channel capture ADC that is capable of interleaved acquisition of 1 channel at 520 MS/s. To enable RF/IF rate pre-processing the DSP464 features Virtex-5 SX95T FPGA optimized for high performance DSP that includes 640 Xilinx XtremeDSP slices capable of delivering up to 352 GMACs. The FPGA can be custom programmed and reconfigured in the field using PARS and is also supported by a wide range of logic cores, filters and blocks.

Optimized for gigahertz-plus communications processing performance and high-speed connectivity Freescale’s PowerQUICC III processor drives the primary XMC and has access to 512MB of DDR2 memory. By implementing a flexible clock distribution circuit based on Analog Device’s AD9510 the DSP464 offers a system-wide synchronized clock, phase adjustment of the ADC and output clocks, and dual-channel quadrature sampling. On-board clock synthesis is based on the AD9540 Low-Jitter DDS synthesizer and coupled with a temperature-compensated reference oscillator, the clock generation is able to provide sub-Hz frequency resolution down to 10Hz accuracy.

DSP464 is targeted at the enterprise networking, telecom transmission and switching, 3G wireless infrastructure, storage and high-end imaging markets, and is available immediately from your local Sundance DSP Office with pricing subject to configuration. For more information visit www.sundancedsp.com or contact salesforce@sundancedsp.com.

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Agilent Technologies’ Latest 3D EM Simulation Software Accelerates High-Frequency, High-Speed Design

SANTA CLARA, Calif., May 20, 2010 — Agilent Technologies Inc. (NYSE: A) today announced Electromagnetic Professional (EMPro) 2010, a new release of its 3D electromagnetic (EM) modeling and simulation software for analyzing the 3D EM effects of IC packages, connectors, antennas and other RF components. Used in the development of high-frequency and high-speed electronic devices, the new release features significant improvements in simulation speed and design efficiency.

“EMPro’s speed, accuracy, and efficiency improvements go a long way in meeting the needs of today’s high-frequency, high-speed device designers,” said Marc Petersen, product marketing lead in Agilent’s EEsof EDA organization. “These improvements also provide a significant benefit to users of our Advanced Design System software, who are using EMPro within their design flow.”

Some of the new capabilities now available in EMPro 2010 include:

  • faster finite element method (FEM) simulations through meshing improvements and use of symmetry planes;
  • built-in acceleration of finite difference time domain (FDTD) simulations utilizing graphics processor unit (GPU) hardware;
  • enhanced FEM accuracy through the use of new sheet ports and material property models;
  • improved design efficiency with a new bondwire component, ODB++ file support for printed-circuit-board designs, and several other new user interface features; and
  • Microsoft Windows® 7 support in addition to Microsoft Windows XP, Vista and Linux support.

More information about EMPro 2010 and Agilent’s 3D EM design flow is available in a new five-minute video on YouTube.

See Agilent Technologies’ latest design and test innovations for advanced RF and microwave research, development and manufacturing at the 2010 IEEE MTT-S International Microwave Symposium, May 25-27, at the Anaheim Convention & ExhibitionCenterBooth 924.

About Agilent EEsof EDA Software

Agilent EEsof EDA is the leading supplier of electronic design automation software for microwave, RF, high-frequency, high-speed, RF system, electronic system level, circuit, 3-D electromagnetic, physical design and device-modeling applications. More information is available at www.agilent.com/find/eesof.

About Agilent Technologies

Agilent Technologies Inc. (NYSE: A) is the world’s premier measurement company and a technology leader in communications, electronics, life sciences and chemical analysis. The company’s 16,000 employees serve customers in more than 110 countries. Agilent had net revenues of $4.5 billion in fiscal 2009. Information about Agilent is available on the Web at www.agilent.com.

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