editor's blog
Subscribe Now

More than Memory

I don’t know about you, but when I hear “Spansion,” I hear memory. But there’s more going on there these days than FLASH. I talked with them last November when they were exhibiting at the IDTechEx show, which is partly about energy harvesting.

In particular, they acquired Fujitsu Microelectronics a year or so prior to broaden their product line. What they got were microcontrollers, with lots of digital and analog connectivity, and analog – primarily power management ICs (PMICs).

With this, they’re gunning for the internet of things (IoT). Surprise! Bet you didn’t see that coming… But they think that batteries are slowing adoption of IoT technology due to their need for low voltages and currents.

So their contribution to this situation is a couple of PMICs for energy harvesting – one is buck (drops in the incoming voltage); the other is boost (although it can drop voltage too if both needed).

Combined.png

 (Image courtesy Spansion)

The MB39C811 is targeted at regulating the voltages generated by solar (dye-sensitized cell and amorphous silicon) and vibrations (through piezoelectric or electret harvesters). The MB39C831 targets all solar as well as thermal harvesting.

They’re targeting industrial applications with these, so they’re pretty full-featured. They’re also working on slimmed-down versions for wearables.

They also have a simulator they call EasyDesign for configuring the energy harvesting module. Based on the needs of the node being powered, it can help determine, for example, how big a solar array is needed, and what the follow-on circuits should look like.

You can find more on their energy-harvesting PMIC page

Leave a Reply

featured blogs
Apr 4, 2020
That metaphorical '€œboing'€ sound you hear, figuratively speaking, is a symbolical ball allegorically landing on Chewy'€™s side of the illusory net....
Apr 3, 2020
Mentor’s Xpedition® IC Packaging design tools bridge the gap between engineering teams for IC layout, package substrate design, and PCB layout with solutions for Chip/Package/PCB prototyping and co-design. They also deliver a complete solution for High Density Advan...
Apr 3, 2020
[From the last episode: We saw some of the mistakes that can cause programs to fail and to breach security and/or privacy.] We'€™ve seen how having more than one program or user resident as a '€œtenant'€ in a server in the cloud can create some challenges '€“ at leas...
Apr 2, 2020
There are many historical innovations that are the product of adversity, and the current situation is an extreme example.  While it is not the first time that humanity has faced a truly global challenge like the COVID-19 pandemic, this time the world is connected by tech...

Featured Video

Industry’s First USB 3.2 Gen 2x2 Interoperability Demo -- Synopsys & ASMedia

Sponsored by Synopsys

Blazingly fast USB 3.2 Gen 2x2 are ready for your SoC. In this video, you’ll see Synopsys and ASMedia demonstrate the throughput available with Synopsys DesignWare USB 3.2 IP.

Learn more about Synopsys USB 3.2